Flexible tracking device for cables and equipment

ABSTRACT

A flexible tracking device for monitoring a cable is configured to be secured to the cable by bending around the cable at a bending region of the flexible tracking device. The flexible tracking device includes a flexible substrate, a battery, a device layer, a flexible circuit connecting components of the device layer and the battery, and a flexible cover layer on the substrate covering the flexible substrate, the battery, the device layer, and the flexible circuit. The device layer includes a processor, a memory coupled to the processor, and a first wireless communication antenna connected to a first wireless communication interface. The flexible tracking device is configured to undergo a bend in the bending region, wherein the bending region does not overlap with components of the device layer that cannot tolerate bending.

CROSS-REFERENCE TO RELATED APPLICATIONS

This application claims priority to U.S. Provisional Patent ApplicationNo. 63/087,282, filed on Oct. 4, 2020, which is incorporated herein inits entirety.

FIELD OF THE DISCLOSURE

This disclosure generally relates to asset tracking and management, andmore particularly to tracking devices.

BACKGROUND

It is difficult to attach conventional tracking devices to cables (e.g.,cables used for electronic equipment) and other objects that have anirregular shape or non-planar geometry for asset tracking andmanagement. Tracking devices and internet of things (IOT) devices thathave conventional, rigid form factors are cumbersome to attach or secureto cables that may need to fit into small spaces or be stored togetherwith a number of other cables or items. For example, if rigid trackingdevices are used to track a large number of cables, the physical spacerequired to store or house the large number of cables increases.

SUMMARY

A flexible tracking device for monitoring a cable is configured to besecured to the cable by bending around the cable at a bending region ofthe flexible tracking device. The flexible tracking device includes aflexible substrate, a battery, a device layer, a flexible circuitconnecting components of the device layer and the battery, and aflexible cover layer on the substrate covering the flexible substrate,the battery, the device layer, and the flexible circuit. The devicelayer includes a processor, a memory coupled to the processor, and afirst wireless communication antenna connected to a first wirelesscommunication interface. The flexible tracking device is configured toundergo a bend in the bending region, wherein the bending region doesnot overlap with components of the device layer that cannot toleratebending.

A method for tracking a cable, is also disclosed herein, that includessecuring a tape node to the cable, associating an identifier of the tapenode with the cable in a database of a tracking system, wirelesslycommunicating with the tape node using a device node or gateway node ofthe tracking system, determining a location of the tape node based onwireless communications between the device node or the gateway node ofthe tracking system and the tape node, responsive to determining thelocation of the tape node, updating a database of the tracking systemwith a location of the cable which corresponds to the determinedlocation of the tape node.

A disclosed system for tracking cables, includes a plurality of tapenodes, each tape node attached to a respective cable, one or moregateway nodes, a server, and a database. Each tape node includes a firsttype of wireless communication system and an identifier associated withthe respective cable. The tape nodes are used to track the location ofeach of the cables. Each gateway node is associated with a fixedlocation and includes the first type of wireless communication systemand a second type of wireless communication system, wherein each gatewaynode is configured to communicate with one or more of the plurality oftape nodes using the first type of wireless communication system andcommunicate with a server using the second type of wirelesscommunication system. The database stores the association of eachidentifier of the plurality of tape nodes with a respective cable, thefixed location of each of the one or more gateway nodes, and a historyof location data for each of the plurality of tape nodes. The serverdetermines a location of each of the plurality of tape nodes based oneach tape node wirelessly communicating with one of the one or moregateway nodes, the location of each of the plurality of tape nodescorresponding to a location of the respective cable. In some furtherembodiments, the system includes a client device configured towirelessly communicate with one or more of the plurality of tape nodesusing the first type of wireless communication system and determine alocation of the one or more tape nodes based on the wirelesscommunication and on a known location of the client device.

BRIEF DESCRIPTION OF THE DRAWINGS

FIG. 1A is a diagrammatic view of an asset that has been sealed forshipment using a segment of an example adhesive tape platform dispensedfrom a roll, according to some embodiments.

FIG. 1B is a diagrammatic top view of a portion of the segment of theexample adhesive tape platform shown in FIG. 1A, according to someembodiments.

FIG. 2 is a diagrammatic view of an example of an envelope carrying asegment of an example adhesive tape platform dispensed from a backingsheet, according to some embodiments.

FIG. 3 is a schematic view of an example segment of an adhesive tapeplatform, according to some embodiments.

FIG. 4 is a diagrammatic top view of a length of an example adhesivetape platform, according to some embodiments.

FIGS. 5A-5C show diagrammatic cross-sectional side views of portions ofdifferent respective adhesive tape platforms, according to someembodiments.

FIGS. 6A-6B are diagrammatic top views of a length of an exampleadhesive tape platform, according to some embodiments.

FIG. 6C is a diagrammatic view of a length of an example adhesive tapeplatform adhered to an asset, according to some embodiments.

FIG. 7 is a diagrammatic view of an example of a network environmentsupporting communications with segments of an adhesive tape platform,according to some embodiments.

FIG. 8 is a diagrammatic view of a hierarchical communications network,according to some embodiments.

FIG. 9 is a flow diagram of a method of creating a hierarchicalcommunications network, according to some embodiments.

FIGS. 10A-10E are diagrammatic views of exemplary use cases for adistributed agent operating system, according to some embodiments.

FIG. 11A shows an embodiment of the tracking device configured to bewrapped around an object to be tracked, according to some embodiments.

FIG. 11B is a cross-sectional diagram of the tape node 1101 shown inFIG. 11A along the line A-A′, according to some embodiments.

FIG. 11C shows the tracking device 1101 wrapped around a portion of acable 1102 for tracking the cable, according to some embodiments.

FIG. 12A shows an example of an alternate embodiment of the trackingdevice configured to wrap around an object to be tracked.

FIG. 12B is a cross-sectional diagram of the tracking device shown inFIG. 12A along the line A-A′, according to some embodiments.

FIG. 12C shows the tracking device shown in FIG. 12A wrapped around aportion of a cable for tracking the cable, according to someembodiments.

FIG. 13 is a diagram showing an embodiment of a tracking deviceincluding a port for passing an object to be tracked through thetracking device, according to some embodiments.

FIGS. 14A-14B are exemplary diagrams showing a tracking device includinga twisting portion configured for twisting and wrapping around an objectto be tracked, according to some embodiments.

FIGS. 15A-15B are diagrams showing an example of an alternate embodimentof the tracking device configured to wrap around an object to be trackedwherein the tracking device includes an empty region, according to someembodiments.

FIG. 16 shows an example embodiment of computer apparatus, according tosome embodiments.

DETAILED DESCRIPTION

A tracking device that has a flexible adhesive tape form factor is usedto perform asset management and tracking. The tracking device may bebent up to 180° in a portion of the tracking device. The tracking deviceis bent around a cable and secured to the cable, according to someembodiments. In other embodiments, the tracking device has a hole thatextends through the thickness of the tracking device, and a cable thatis being tracked is threaded through the hole.

In some embodiments, the wireless IOT device is an adhesive tapeplatform or a segment thereof. The adhesive tape platform includeswireless transducing components and circuitry that perform communicationand/or sensing. The adhesive tape platform has a flexible adhesive tapeform-factor that allows it to function as both an adhesive tape foradhering to and/or sealing objects and a wireless sensing device.

In the following description, like reference numbers are used toidentify like elements. Furthermore, the drawings are intended toillustrate major features of exemplary embodiments in a diagrammaticmanner. The drawings are not intended to depict every feature of actualembodiments nor relative dimensions of the depicted elements and are notdrawn to scale.

As used herein, the term “or” refers to an inclusive “or” rather than anexclusive “or.” In addition, the articles “a” and “an” as used in thespecification and claims mean “one or more” unless specified otherwiseor clear from the context to refer the singular form.

The term “tape node” refers to an adhesive tape platform or a segmentthereof that is equipped with sensor, processor, memory, energysource/harvesting mechanism, and wireless communications functionality,where the adhesive tape platform (also referred to herein as an“adhesive product” or an “adhesive tape product”) has a variety ofdifferent form factors, including a multilayer roll or a sheet thatincludes a plurality of divisible adhesive segments. Once deployed, eachtape node can function, for example, as an adhesive tape, label,sticker, decal, or the like, and as a wireless communications device.

The terms “adhesive tape node,” “wireless node,” or “tape node” may beused interchangeably in certain contexts, and refer to an adhesive tapeplatform or a segment thereof that is equipped with sensor, processor,memory, energy source/harvesting mechanism, and wireless communicationsfunctionality, where the adhesive product has a variety of differentform factors, including a multilayer roll or a sheet that includes aplurality of divisible adhesive segments. Once deployed, each tape nodeor wireless node can function, for example, as an adhesive tape, label,sticker, decal, or the like, and as a wireless communications device. A“peripheral” tape node or wireless node, also referred to as an outernode, leaf node, or terminal node, refers to a node that does not haveany child nodes.

In certain contexts, the terms “parcel,” “envelope,” “box,” “package,”“container,” “pallet,” “carton,” “wrapping,” and the like are usedinterchangeably herein to refer to a packaged item or items.

In certain contexts, the terms “wireless tracking system,” “hierarchicalcommunications network,” “distributed agent operating system,” and thelike are used interchangeably herein to refer to a system or network ofwireless nodes.

Introduction

This specification describes a low-cost, multi-function adhesive tapeplatform with a form factor that unobtrusively integrates the componentsuseful for implementing a combination of different asset tracking andmanagement functions and also is able to perform a useful ancillaryfunction that otherwise would have to be performed with the attendantneed for additional materials, labor, and expense. In an aspect, theadhesive tape platform is implemented as a collection of adhesiveproducts that integrate wireless communications and sensing componentswithin a flexible adhesive structure in a way that not only provides acost-effective platform for interconnecting, optimizing, and protectingthe components of the tracking system but also maintains the flexibilityneeded to function as an adhesive product that can be deployedseamlessly and unobtrusively into various asset management and trackingapplications and workflows, including person and object trackingapplications, and asset management workflows such as manufacturing,storage, shipping, delivery, and other logistics associated with movingproducts and other physical objects, including logistics, sensing,tracking, locationing, warehousing, parking, safety, construction, eventdetection, road management and infrastructure, security, and healthcare.In some examples, the adhesive tape platforms are used in variousaspects of asset management, including sealing assets, transportingassets, tracking assets, monitoring the conditions of assets,inventorying assets, and verifying asset security. In these examples,the assets typically are transported from one location to another bytruck, train, ship, or aircraft or within premises, e.g., warehouses byforklift, trolleys etc.

In disclosed examples, an adhesive tape platform includes a plurality ofsegments that can be separated from the adhesive product (e.g., bycutting, tearing, peeling, or the like) and adhesively attached to avariety of different surfaces to inconspicuously implement any of a widevariety of different wireless communications based networkcommunications and transducing (e.g., sensing, actuating, etc.)applications. Examples of such applications include: event detectionapplications, monitoring applications, security applications,notification applications, and tracking applications, includinginventory tracking, asset tracking, person tracking, animal (e.g., pet)tracking, manufactured parts tracking, and vehicle tracking. In exampleembodiments, each segment of an adhesive tape platform is equipped withan energy source, wireless communication functionality, transducingfunctionality, and processing functionality that enable the segment toperform one or more transducing functions and report the results to aremote server or other computer system directly or through a network oftapes. The components of the adhesive tape platform are encapsulatedwithin a flexible adhesive structure that protects the components fromdamage while maintaining the flexibility needed to function as anadhesive tape (e.g., duct tape or a label) for use in variousapplications and workflows. In addition to single function applications,example embodiments also include multiple transducers (e.g., sensingand/or actuating transducers) that extend the utility of the platformby, for example, providing supplemental information and functionalityrelating characteristics of the state and or environment of, forexample, an article, object, vehicle, or person, over time.

Systems and processes for fabricating flexible multifunction adhesivetape platforms in efficient and low-cost ways also are described. Inaddition to using roll-to-roll and/or sheet-to-sheet manufacturingtechniques, the fabrication systems and processes are configured tooptimize the placement and integration of components within the flexibleadhesive structure to achieve high flexibility and ruggedness. Thesefabrication systems and processes are able to create useful and reliableadhesive tape platforms that can provide local sensing, wirelesstransmitting, and locationing functionalities. Such functionalitytogether with the low cost of production is expected to encourage theubiquitous deployment of adhesive tape platform segments and therebyalleviate at least some of the problems arising from gaps inconventional infrastructure coverage that prevent continuous monitoring,event detection, security, tracking, and other asset tracking andmanagement applications across heterogeneous environments.

Adhesive Tape Platform

FIG. 1A shows an example asset 10 that is sealed for shipment using anexample adhesive tape platform 12 that includes embedded components of awireless transducing circuit 14 (collectively referred to herein as a“tape node”). In this example, a length 13 of the adhesive tape platform12 is dispensed from a roll 16 and affixed to the asset 10. The adhesivetape platform 12 includes an adhesive side 18 and a non-adhesive side20. The adhesive tape platform 12 can be dispensed from the roll 16 inthe same way as any conventional packing tape, shipping tape, or ducttape. For example, the adhesive tape platform 12 may be dispensed fromthe roll 16 by hand, laid across the seam where the two top flaps of theasset 10 meet, and cut to a suitable length either by hand or using acutting instrument (e.g., scissors or an automated or manual tapedispenser). Examples of such tapes include tapes having non-adhesivesides 20 that carry one or more coatings or layers (e.g., colored, lightreflective, light absorbing, and/or light emitting coatings or layers).

Referring to FIG. 1B, in some examples, the non-adhesive side 20 of thelength 13 of the adhesive tape platform 12 includes writing or othermarkings that convey instructions, warnings, or other information to aperson or machine (e.g., a bar code reader), or may simply be decorativeand/or entertaining. For example, different types of adhesive tapeplatforms may be marked with distinctive colorations to distinguish onetype of adhesive tape platform from another. In the illustrated example,the length 13 of the adhesive tape platform 12 includes atwo-dimensional bar code (e.g., a QR Code) 22, written instructions 24(i.e., “Cut Here”), and an associated cut line 26 that indicates wherethe user should cut the adhesive tape platform 12. The writteninstructions 24 and the cut line 26 typically are printed or otherwisemarked on the top non-adhesive surface 20 of the adhesive tape platform12 during manufacture. The two-dimensional bar code 22, on the otherhand, may be marked on the non-adhesive surface 20 of the adhesive tapeplatform 12 during the manufacture of the adhesive product 12 or,alternatively, may be marked on the non-adhesive surface 20 of theadhesive tape platform 12 as needed using, for example, a printer orother marking device.

In order to avoid damage to the functionality of the segments of theadhesive tape platform 12, the cut lines 26 typically demarcate theboundaries between adjacent segments at locations that are free of anyactive components of the wireless transducing circuit 14. The spacingbetween the wireless transducing circuit components 14 and the cut lines26 may vary depending on the intended communication, transducing and/oradhesive taping application. In the example illustrated in FIG. 1A, thelength of the adhesive tape platform 12 that is dispensed to seal theasset 10 corresponds to a single segment of the adhesive tape platform12. In other examples, the length of the adhesive tape platform 12needed to seal a asset or otherwise serve the adhesive function forwhich the adhesive tape platform 12 is being applied may includemultiple segments 13 of the adhesive tape platform 12, one or more ofwhich segments 13 may be activated upon cutting the length of theadhesive tape platform 12 from the roll 16 and/or applying the length ofthe adhesive tape platform to the asset 10.

In some examples, the transducing components 14 that are embedded in oneor more segments 13 of the adhesive tape platform 12 are activated whenthe adhesive tape platform 12 is cut along the cut line 26. In theseexamples, the adhesive tape platform 12 includes one or more embeddedenergy sources (e.g., thin film batteries, which may be printed, orconventional cell batteries, such as conventional watch style batteries,rechargeable batteries, or other energy storage device, such as a supercapacitor or charge pump) that supply power to the transducingcomponents 14 in one or more segments of the adhesive tape platform 12in response to being separated from the adhesive tape platform 12 (e.g.,along the cut line 26).

In some examples, each segment 13 of the adhesive tape platform 12includes its own respective energy source including energy harvestingelements that can harvest energy from the environment. In some of theseexamples, each energy source is configured to only supply power to thecomponents in its respective adhesive tape platform segment regardlessof the number of contiguous segments 13 that are in a given length ofthe adhesive tape platform 12. In other examples, when a given length ofthe adhesive tape platform 12 includes multiple segments 13, the energysources in the respective segments 13 are configured to supply power tothe transducing components 14 in all of the segments 13 in the givenlength of the adhesive tape platform 12. In some of these examples, theenergy sources are connected in parallel and concurrently activated topower the transducing components 14 in all of the segments 13 at thesame time. In other examples, the energy sources are connected inparallel and alternately activated to power the transducing components14 in respective ones of the adhesive tape platform segments 13 atdifferent time periods, which may or may not overlap.

FIG. 2 shows an example adhesive tape platform 30 that includes a set ofadhesive tape platform segments 32 each of which includes a respectiveset of embedded wireless transducing circuit components 34, and abacking sheet 36 with a release coating that prevents the adhesivesegments 32 from adhering strongly to the backing sheet 36. Eachadhesive tape platform segment 32 includes an adhesive side facing thebacking sheet 36, and an opposing non-adhesive side 40. In this example,a particular segment 32′ of the adhesive tape platform 30 has beenremoved from the backing sheet 36 and affixed to an envelope 44. Eachsegment 32 of the adhesive tape platform 30 can be removed from thebacking sheet 36 in the same way that adhesive labels can be removedfrom a conventional sheet of adhesive labels (e.g., by manually peelinga segment 32 from the backing sheet 36). In general, the non-adhesiveside 40′ of the segment 32′ may include any type of writing, markings,decorative designs, or other ornamentation. In the illustrated example,the non-adhesive side 40′ of the segment 32′ includes writing or othermarkings that correspond to a destination address for the envelope 44.The envelope 44 also includes a return address 46 and, optionally, apostage stamp or mark 48.

In some examples, segments of the adhesive tape platform 12 are deployedby a human operator. The human operator may be equipped with a mobilephone or other device that allows the operator to authenticate andinitialize the adhesive tape platform 12. In addition, the operator cantake a picture of a asset including the adhesive tape platform and anybarcodes associated with the asset and, thereby, create a persistentrecord that links the adhesive tape platform 12 to the asset. Inaddition, the human operator typically will send the picture to anetwork service and/or transmit the picture to the adhesive tapeplatform 12 for storage in a memory component of the adhesive tapeplatform 12.

In some examples, the wireless transducing circuit components 34 thatare embedded in a segment 32 of the adhesive tape platform 12 areactivated when the segment 32 is removed from the backing sheet 32. Insome of these examples, each segment 32 includes an embedded capacitivesensing system that can sense a change in capacitance when the segment32 is removed from the backing sheet 36. As explained in detail below, asegment 32 of the adhesive tape platform 30 includes one or moreembedded energy sources (e.g., thin film batteries, common disk-shapedcell batteries, or rechargeable batteries or other energy storagedevices, such as a super capacitor or charge pump) that can beconfigured to supply power to the wireless transducing circuitcomponents 34 in the segment 32 in response to the detection of a changein capacitance between the segment 32 and the backing sheet 36 as aresult of removing the segment 32 from the backing sheet 36.

FIG. 3 shows a block diagram of the components of an example wirelesstransducing circuit 70 that includes a number of communication systems72, 74. Example communication systems 72, 74 include a GPS system thatincludes a GPS receiver circuit 82 (e.g., a receiver integrated circuit)and a GPS antenna 84, and one or more wireless communication systemseach of which includes a respective transceiver circuit 86 (e.g., atransceiver integrated circuit) and a respective antenna 88. Examplewireless communication systems include a cellular communication system(e.g., GSM/GPRS), a Wi-Fi communication system, an RF communicationsystem (e.g., LoRa), a Bluetooth communication system (e.g., a BluetoothLow Energy system), a Z-wave communication system, and a ZigBeecommunication system. The wireless transducing circuit 70 also includesa processor 90 (e.g., a microcontroller or microprocessor), one or moreenergy storage devices 92 (e.g., non-rechargeable or rechargeableprinted flexible battery, conventional single or multiple cell battery,and/or a super capacitor or charge pump), one or more transducers 94(e.g., sensors and/or actuators, and, optionally, one or more energyharvesting transducer components). In some examples, the conventionalsingle or multiple cell battery may be a watch style disk or button cellbattery that is associated electrical connection apparatus (e.g., ametal clip) that electrically connects the electrodes of the battery tocontact pads on the flexible circuit 116.

Examples of sensing transducers 94 include a capacitive sensor, analtimeter, a gyroscope, an accelerometer, a temperature sensor, a strainsensor, a pressure sensor, a piezoelectric sensor, a weight sensor, anoptical or light sensor (e.g., a photodiode or a camera), an acoustic orsound sensor (e.g., a microphone), a smoke detector, a radioactivitysensor, a chemical sensor (e.g., an explosives detector), a biosensor(e.g., a blood glucose biosensor, odor detectors, antibody basedpathogen, food, and water contaminant and toxin detectors, DNAdetectors, microbial detectors, pregnancy detectors, and ozonedetectors), a magnetic sensor, an electromagnetic field sensor, and ahumidity sensor. Examples of actuating (e.g., energy emitting)transducers 94 include light emitting components (e.g., light emittingdiodes and displays), electro-acoustic transducers (e.g., audiospeakers), electric motors, and thermal radiators (e.g., an electricalresistor or a thermoelectric cooler).

In some examples, the wireless transducing circuit 70 includes a memory96 for storing data, including, e.g., profile data, state data, eventdata, sensor data, localization data, security data, and one or moreunique identifiers (ID) 98 associated with the wireless transducingcircuit 70, such as a product ID, a type ID, and a media access control(MAC) ID, and control code 99. In some examples, the memory 96 may beincorporated into one or more of the processor 90 or transducers 94, ormay be a separate component that is integrated in the wirelesstransducing circuit 70 as shown in FIG. 3 . The control code typicallyis implemented as programmatic functions or program modules that controlthe operation of the wireless transducing circuit 70, including a tapenode communication manager that manages the manner and timing of tapenode communications, a tape node power manager that manages powerconsumption, and a tape node connection manager that controls whetherconnections with other tape nodes are secure connections or unsecureconnections, and a tape node storage manager that securely manages thelocal data storage on the node. The tape node connection manager ensuresthe level of security required by the end application and supportsvarious encryption mechanisms. The tape node power manager and tapecommunication manager work together to optimize the battery consumptionfor data communication. In some examples, execution of the control codeby the different types of tape nodes described herein may result in theperformance of similar or different functions.

FIG. 4 is a top view of a portion of an example flexible adhesive tapeplatform 100 that shows a first segment 102 and a portion of a secondsegment 104. Each segment 102, 104 of the flexible adhesive tapeplatform 100 includes a respective set 106, 108 of the components of thewireless transducing circuit 70. The segments 102, 104 and theirrespective sets of components 106, 108 typically are identical andconfigured in the same way. In some other embodiments, however, thesegments 102, 104 and/or their respective sets of components 106, 108are different and/or configured in different ways. For example, in someexamples, different sets of the segments of the flexible adhesive tapeplatform 100 have different sets or configurations of tracking and/ortransducing components that are designed and/or optimized for differentapplications, or different sets of segments of the flexible adhesivetape platform may have different ornamentations (e.g., markings on theexterior surface of the platform) and/or different (e.g., alternating)lengths.

An example method of fabricating the adhesive tape platform 100 (seeFIG. 4 ) according to a roll-to-roll fabrication process is described inconnection with FIGS. 6, 7A, and 7B of U.S. Pat. No. 10,262,255, issuedApr. 16, 2019, the entirety of which is incorporated herein byreference.

The instant specification describes an example system of adhesive tapeplatforms (also referred to herein as “tape nodes”) that can be used toimplement a low-cost wireless network infrastructure for performingmonitoring, tracking, and other asset management functions relating to,for example, parcels, persons, tools, equipment and other physicalassets and objects. The example system includes a set of three differenttypes of tape nodes that have different respective functionalities anddifferent respective cover markings that visually distinguish thedifferent tape node types from one another. In one non-limiting example,the covers of the different tape node types are marked with differentcolors (e.g., white, green, and black). In the illustrated examples, thedifferent tape node types are distinguishable from one another by theirrespective wireless communications capabilities and their respectivesensing capabilities.

FIG. 5A shows a cross-sectional side view of a portion of an examplesegment 102 of the flexible adhesive tape platform 100 that includes arespective set of the components of the wireless transducing circuit 106corresponding to the first tape node type (i.e., white). The flexibleadhesive tape platform segment 102 includes an adhesive layer 112, anoptional flexible substrate 110, and an optional adhesive layer 114 onthe bottom surface of the flexible substrate 110. If the bottom adhesivelayer 114 is present, a release liner (not shown) may be (weakly)adhered to the bottom surface of the adhesive layer 114. In someexamples, the adhesive layer 114 includes an adhesive (e.g., an acrylicfoam adhesive) that has a high bond strength that is sufficient toprevent removal of the adhesive segment 102 from a surface on which theadhesive layer 114 is adhered without destroying the physical ormechanical integrity of the adhesive segment 102 and/or one or more ofits constituent components. In some examples, the optional flexiblesubstrate 110 is implemented as a prefabricated adhesive tape thatincludes the adhesive layers 112, 114 and the optional release liner. Inother examples, the adhesive layers 112, 114 are applied to the top andbottom surfaces of the flexible substrate 110 during the fabrication ofthe adhesive tape platform 100. The adhesive layer 112 bonds theflexible substrate 110 to a bottom surface of a flexible circuit 116,that includes one or more wiring layers (not shown) that connect theprocessor 90, a low power wireless communication interface 81 (e.g., aZigbee, Bluetooth® Low Energy (BLE) interface, or other low powercommunication interface), a timer circuit 83, transducing and/or energyharvesting component(s) 94 (if present), the memory 96, and othercomponents in a device layer 122 to each other and to the energy storagecomponent 92 and, thereby, enable the transducing, tracking and otherfunctionalities of the flexible adhesive tape platform segment 102. Thelow power wireless communication interface 81 typically includes one ormore of the antennas 84, 88 and one or more of the wireless circuits 82,86.

FIG. 5B shows a cross-sectional side view of a portion of an examplesegment 103 of the flexible adhesive tape platform 100 that includes arespective set of the components of the wireless transducing circuit 106corresponding to the second tape node type (i.e., green). In thisexample, the flexible adhesive tape platform segment 103 differs fromthe segment 102 shown in FIG. 5A by the inclusion of a medium powercommunication interface 85 (e.g., a LoRa interface) in addition to thelow power communications interface that is present in the first tapenode type (i.e., white). The medium power communication interface haslonger communication range than the low power communication interface.In some examples, one or more other components of the flexible adhesivetape platform segment 103 differ, for example, in functionality orcapacity (e.g., larger energy source).

FIG. 5C shows a cross-sectional side view of a portion of an examplesegment 105 of the flexible adhesive tape platform 100 that includes arespective set of the components of the wireless transducing circuit 106corresponding to the third tape node type (i.e., black). In thisexample, the flexible adhesive tape platform segment 105 includes a highpower communications interface 87 (e.g., a cellular interface; e.g.,GSM/GPRS) and an optional medium and/or low power communicationsinterface 85. The high power communication range provides globalcoverage to available infrastructure (e.g. the cellular network). Insome examples, one or more other components of the flexible adhesivetape platform segment 105 differ, for example, in functionality orcapacity (e.g., larger energy source).

FIGS. 5A-5C show examples in which the cover layer 128 of the flexibleadhesive tape platform 100 includes one or more interfacial regions 129positioned over one or more of the transducers 94. In examples, one ormore of the interfacial regions 129 have features, properties,compositions, dimensions, and/or characteristics that are designed toimprove the operating performance of the platform 100 for specificapplications. In some examples, the flexible adhesive tape platform 100includes multiple interfacial regions 129 over respective transducers94, which may be the same or different depending on the targetapplications. Example interfacial regions include an opening, anoptically transparent window, and/or a membrane located in theinterfacial region 129 of the cover 128 that is positioned over the oneor more transducers and/or energy harvesting components 94. Additionaldetails regarding the structure and operation of example interfacialregions 129 are described in U.S. Provisional Patent Application No.62/680,716, filed Jun. 5, 2018, PCT Patent Application No.PCT/US2018/064919, filed Dec. 11, 2018, U.S. Pat. No. 10,885,420, issuedJan. 4, 2021, U.S. Pat. No. 10,902,310 issued Jan. 25, 2021, and U.S.Provisional Patent Application No. 62/670,712, filed May 11, 2018, allof which are incorporated herein in their entirety.

In some examples, a flexible polymer layer 124 encapsulates the devicelayer 122 and thereby reduces the risk of damage that may result fromthe intrusion of contaminants and/or liquids (e.g., water) into thedevice layer 122. The flexible polymer layer 124 also planarizes thedevice layer 122. This facilitates optional stacking of additionallayers on the device layer 122 and also distributes forces generated in,on, or across the adhesive tape platform segment 102 so as to reducepotentially damaging asymmetric stresses that might be caused by theapplication of bending, torqueing, pressing, or other forces that may beapplied to the flexible adhesive tape platform segment 102 during use.In the illustrated example, a flexible cover 128 is bonded to theplanarizing polymer 124 by an adhesive layer (not shown).

The flexible cover 128 and the flexible substrate 110 may have the sameor different compositions depending on the intended application. In someexamples, one or both of the flexible cover 128 and the flexiblesubstrate 110 include flexible film layers and/or paper substrates,where the film layers may have reflective surfaces or reflective surfacecoatings. Example compositions for the flexible film layers includepolymer films, such as polyester, polyimide, polyethylene terephthalate(PET), and other plastics. The optional adhesive layer on the bottomsurface of the flexible cover 128 and the adhesive layers 112, 114 onthe top and bottom surfaces of the flexible substrate 110 typicallyinclude a pressure-sensitive adhesive (e.g., a silicon-based adhesive).In some examples, the adhesive layers are applied to the flexible cover128 and the flexible substrate 110 during manufacture of the adhesivetape platform 100 (e.g., during a roll-to-roll or sheet-to-sheetfabrication process). In other examples, the flexible cover 128 may beimplemented by a prefabricated single-sided pressure-sensitive adhesivetape and the flexible substrate 110 may be implemented by aprefabricated double-sided pressure-sensitive adhesive tape; both kindsof tape may be readily incorporated into a roll-to-roll orsheet-to-sheet fabrication process. In some examples, the flexiblepolymer layer 124 is composed of a flexible epoxy (e.g., silicone).

In some examples, the energy storage device 92 is a flexible batterythat includes a printed electrochemical cell, which includes a planararrangement of an anode and a cathode and battery contact pads. In someexamples, the flexible battery may include lithium-ion cells ornickel-cadmium electro-chemical cells. The flexible battery typically isformed by a process that includes printing or laminating theelectro-chemical cells on a flexible substrate (e.g., a polymer filmlayer). In some examples, other components may be integrated on the samesubstrate as the flexible battery. For example, the low power wirelesscommunication interface 81 and/or the processor(s) 90 may be integratedon the flexible battery substrate. In some examples, one or more of suchcomponents also (e.g., the flexible antennas and the flexibleinterconnect circuits) may be printed on the flexible battery substrate.

In some examples, the flexible circuit 116 is formed on a flexiblesubstrate by printing, etching, or laminating circuit patterns on theflexible substrate. In some examples, the flexible circuit 116 isimplemented by one or more of a single-sided flex circuit, a doubleaccess or back bared flex circuit, a sculpted flex circuit, adouble-sided flex circuit, a multi-layer flex circuit, a rigid flexcircuit, and a polymer thick film flex circuit. A single-sided flexiblecircuit has a single conductor layer made of, for example, a metal orconductive (e.g., metal filled) polymer on a flexible dielectric film. Adouble access or back bared flexible circuit has a single conductorlayer but is processed so as to allow access to selected features of theconductor pattern from both sides. A sculpted flex circuit is formedusing a multi-step etching process that produces a flex circuit that hasfinished copper conductors that vary in thickness along their respectivelengths. A multilayer flex circuit has three of more layers ofconductors, where the layers typically are interconnected using platedthrough holes. Rigid flex circuits are a hybrid construction of flexcircuit consisting of rigid and flexible substrates that are laminatedtogether into a single structure, where the layers typically areelectrically interconnected via plated through holes. In polymer thickfilm (PTF) flex circuits, the circuit conductors are printed onto apolymer base film, where there may be a single conductor layer ormultiple conductor layers that are insulated from one another byrespective printed insulating layers.

In the example flexible adhesive tape platform segments 102 shown inFIGS. 5A-5C, the flexible circuit 116 is a single access flex circuitthat interconnects the components of the adhesive tape platform on asingle side of the flexible circuit 116. In other examples, the flexiblecircuit 116 is a double access flex circuit that includes a front-sideconductive pattern that interconnects the low power communicationsinterface 81, the timer circuit 83, the processor 90, the one or moretransducers 94 (if present), and the memory 96, and allows through-holeaccess (not shown) to a back-side conductive pattern that is connectedto the flexible battery (not shown). In these examples, the front-sideconductive pattern of the flexible circuit 116 connects thecommunications circuits 82, 86 (e.g., receivers, transmitters, andtransceivers) to their respective antennas 84, 88 and to the processor90, and also connects the processor 90 to the one or more sensors 94 andthe memory 96. The backside conductive pattern connects the activeelectronics (e.g., the processor 90, the communications circuits 82, 86,and the transducers) on the front-side of the flexible circuit 116 tothe electrodes of the flexible battery 116 via one or more through holesin the substrate of the flexible circuit 116.

Depending on the target application, the wireless transducing circuits70 are distributed across the flexible adhesive tape platform 100according to a specified sampling density, which is the number ofwireless transducing circuits 70 for a given unit size (e.g., length orarea) of the flexible adhesive tape platform 100. In some examples, aset of multiple flexible adhesive tape platforms 100 are provided thatinclude different respective sampling densities in order to sealdifferent asset sizes with a desired number of wireless transducingcircuits 70. In particular, the number of wireless transducing circuitsper asset size is given by the product of the sampling density specifiedfor the adhesive tape platform and the respective size of the adhesivetape platform 100 needed to seal the asset. This allows an automatedpackaging system to select the appropriate type of flexible adhesivetape platform 100 to use for sealing a given asset with the desiredredundancy (if any) in the number of wireless transducer circuits 70. Insome example applications (e.g., shipping low value goods), only onewireless transducing circuit 70 is used per asset, whereas in otherapplications (e.g., shipping high value goods) multiple wirelesstransducing circuits 70 are used per asset. Thus, a flexible adhesivetape platform 100 with a lower sampling density of wireless transducingcircuits 70 can be used for the former application, and a flexibleadhesive tape platform 100 with a higher sampling density of wirelesstransducing circuits 70 can be used for the latter application. In someexamples, the flexible adhesive tape platforms 100 are color-coded orotherwise marked to indicate the respective sampling densities withwhich the wireless transducing circuits 70 are distributed across thedifferent types of adhesive tape platforms 100.

Referring to FIG. 6A, in some examples, each of one or more of thesegments 270, 272 of a flexible adhesive tape platform 274 includes arespective one-time wake circuit 275 that delivers power from therespective energy source 276 to the respective wireless circuit 278(e.g., a processor, one or more transducers, and one or more wirelesscommunications circuits) in response to an event. In some of theseexamples, the wake circuit 275 is configured to transition from an offstate to an on state when the voltage on the wake node 277 exceeds athreshold level, at which point the wake circuit transitions to an onstate to power-on the segment 270. In the illustrated example, thisoccurs when the user separates the segment from the adhesive tapeplatform 274, for example, by cutting across the adhesive tape platform274 at a designated location (e.g., along a designated cut-line 280). Inparticular, in its initial, un-cut state, a minimal amount of currentflows through the resistors R1 and R2. As a result, the voltage on thewake node 277 remains below the threshold turn-on level. After the usercuts across the adhesive tape platform 274 along the designated cut-line280, the user creates an open circuit in the loop 282, which pulls thevoltage of the wake node above the threshold level and turns on the wakecircuit 275. As a result, the voltage across the energy source 276 willappear across the wireless circuit 278 and, thereby, turn on the segment270. In particular embodiments, the resistance value of resistor R1 isgreater than the resistance value of R2. In some examples, theresistance values of resistors R1 and R2 are selected based on theoverall design of the adhesive product system (e.g., the target wakevoltage level and a target leakage current).

In some examples, each of one or more of the segments of an adhesivetape platform includes a respective sensor and a respective wake circuitthat delivers power from the respective energy source to the respectiveone or more of the respective wireless circuit components 278 inresponse to an output of the sensor. In some examples, the respectivesensor is a strain sensor that produces a wake signal based on a changein strain in the respective segment. In some of these examples, thestrain sensor is affixed to a adhesive tape platform and configured todetect the stretching of the tracking adhesive tape platform segment asthe segment is being peeled off a roll or a sheet of the adhesive tapeplatform. In some examples, the respective sensor is a capacitive sensorthat produces a wake signal based on a change in capacitance in therespective segment. In some of these examples, the capacitive sensor isaffixed to an adhesive tape platform and configured to detect theseparation of the tracking adhesive tape platform segment from a roll ora sheet of the adhesive tape platform. In some examples, the respectivesensor is a flex sensor that produces a wake signal based on a change incurvature in the respective segment. In some of these examples, the flexsensor is affixed to a adhesive tape platform and configured to detectbending of the tracking adhesive tape platform segment as the segment isbeing peeled off a roll or a sheet of the adhesive tape platform. Insome examples, the respective sensor is a near field communicationssensor that produces a wake signal based on a change in inductance inthe respective segment.

FIG. 6B shows another example of an adhesive tape platform 294 thatdelivers power from the respective energy source 276 to the respectivetracking circuit 278 (e.g., a processor, one or more transducers, andone or more wireless communications circuits) in response to an event.This example is similar in structure and operation as the adhesive tapeplatform 294 shown in FIG. 6A, except that the wake circuit 275 isimplemented by a switch 296 that is configured to transition from anopen state to a closed state when the voltage on the switch node 277exceeds a threshold level. In the initial state of the adhesive tapeplatform 294, the voltage on the switch node is below the thresholdlevel as a result of the low current level flowing through the resistorsR1 and R2. After the user cuts across the adhesive tape platform 294along the designated cut-line 280, the user creates an open circuit inthe loop 282, which pulls up the voltage on the switch node above thethreshold level to close the switch 296 and turn on the wireless circuit278.

FIG. 6C shows a diagrammatic cross-sectional front view of an exampleadhesive tape platform 300 and a perspective view of an example asset302. Instead of activating the adhesive tape platform in response toseparating a segment of the adhesive tape platform from a roll or asheet of the adhesive tape platform, this example is configured tosupply power from the energy source 302 to turn on the wirelesstransducing circuit 306 in response to establishing an electricalconnection between two power terminals 308, 310 that are integrated intothe adhesive tape platform. In particular, each segment of the adhesivetape platform 300 includes a respective set of embedded trackingcomponents, an adhesive layer 312, and an optional backing sheet 314with a release coating that prevents the segments from adhering stronglyto the backing sheet 314. In some examples, the power terminals 308, 310are composed of an electrically conductive material (e.g., a metal, suchas copper) that may be printed or otherwise patterned and/or depositedon the backside of the adhesive tape platform 300. In operation, theadhesive tape platform can be activated by removing the backing sheet314 and applying the exposed adhesive layer 312 to a surface thatincludes an electrically conductive region 316. In the illustratedembodiment, the electrically conductive region 316 is disposed on aportion of the asset 302. When the adhesive backside of the adhesivetape platform 300 is adhered to the asset with the exposed terminals308, 310 aligned and in contact with the electrically conductive region316 on the asset 302, an electrical connection is created through theelectrically conductive region 316 between the exposed terminals 308,310 that completes the circuit and turns on the wireless transducingcircuit 306. In particular embodiments, the power terminals 308, 310 areelectrically connected to any respective nodes of the wirelesstransducing circuit 306 that would result in the activation of thetracking circuit 306 in response to the creation of an electricalconnection between the power terminals 308, 310.

In some examples, after a tape node is turned on, it will communicatewith the network service to confirm that the user/operator who isassociated with the tape node is an authorized user who hasauthenticated himself or herself to the network service 54. In theseexamples, if the tape node cannot confirm that the user/operator is anauthorized user, the tape node will turn itself off.

Deployment of Tape Nodes

FIG. 7 shows an example network communications environment 400 (alsoreferred to herein as a “tracking system” 400) that includes a network402 that supports communications between one or more servers 404executing one or more applications of a network service 408, mobilegateways 410, 412, a stationary gateway 414, and various types of tapenodes that are associated with various assets (e.g., parcels, equipment,tools, persons, and other things). Each member of the Tracking system400 may be referred to as a node of the Tracking system 400, includingthe tape nodes, other wireless IOT devices, gateways (stationary andmobile), client devices, and servers. In some examples, the network 402includes one or more network communication systems and technologies,including any one or more of wide area networks, local area networks,public networks (e.g., the internet), private networks (e.g., intranetsand extranets), wired networks, and wireless networks. For example, thenetwork 402 includes communications infrastructure equipment, such as ageolocation satellite system 416 (e.g., GPS, GLONASS, and NAVSTAR),cellular communication systems (e.g., GSM/GPRS), Wi-Fi communicationsystems, RF communication systems (e.g., LoRa), Bluetooth communicationsystems (e.g., a Bluetooth Low Energy system), Z-wave communicationsystems, and ZigBee communication systems.

In some examples, the one or more network service applications 406leverage the above-mentioned communications technologies to create ahierarchical wireless network of tape nodes that improves assetmanagement operations by reducing costs and improving efficiency in awide range of processes, from asset packaging, asset transporting, assettracking, asset condition monitoring, asset inventorying, and assetsecurity verification. Communication across the network is secured by avariety of different security mechanisms. In the case of existinginfrastructure, a communication link the communication uses theinfrastructure security mechanisms. In case of communications amongtapes nodes, the communication is secured through a custom securitymechanism. In certain cases, tape nodes can also be configured tosupport block chain to protect the transmitted and stored data.

A set of tape nodes can be configured by the network service 408 tocreate hierarchical communications network. The hierarchy can be definedin terms of one or more factors, including functionality (e.g., wirelesstransmission range or power), role (e.g., master tape node vs.peripheral tape node), or cost (e.g., a tape node equipped with acellular transceiver vs. a peripheral tape node equipped with aBluetooth LE transceiver). Tape nodes can be assigned to differentlevels of a hierarchical network according to one or more of theabove-mentioned factors. For example, the hierarchy can be defined interms of communication range or power, where tape nodes with higherpower or longer communication range transceivers are arranged at ahigher level of the hierarchy than tape nodes with lower power or lowerrange transceivers. In another example, the hierarchy is defined interms of role, where, e.g., a master tape node is programmed to bridgecommunications between a designated group of peripheral tape nodes and agateway node or server node. The problem of finding an optimalhierarchical structure can be formulated as an optimization problem withbattery capacity of nodes, power consumption in various modes ofoperation, desired latency, external environment, etc. and can be solvedusing modern optimization methods e.g. neural networks, artificialintelligence, and other machine learning computing systems that takeexpected and historical data to create an optimal solution and cancreate algorithms for modifying the system's behavior adaptively in thefield.

The tape nodes may be deployed by automated equipment or manually. Inthis process, a tape node typically is separated from a roll or sheetand adhered to a asset, or other stationary or mobile object (e.g., astructural element of a warehouse, or a vehicle, such as a deliverytruck) or stationary object (e.g., a structural element of a building).This process activates the tape node and causes the tape node tocommunicate with a server 404 of the network service 408. In thisprocess, the tape node may communicate through one or more other tapenodes in the communication hierarchy. In this process, the networkserver 404 executes the network service application 406 toprogrammatically configure tape nodes that are deployed in theenvironment 400. In some examples, there are multiple classes or typesof tape nodes, where each tape node class has a different respective setof functionalities and/or capacities.

In some examples, the one or more network service servers 404communicate over the network 402 with one or more gateways that areconfigured to send, transmit, forward, or relay messages to the network402 and activated tape nodes that are associated with respective assetsand within communication range. Example gateways include mobile gateways410, 412 and a stationary gateway 414. In some examples, the mobilegateways 410, 412, and the stationary gateway 414 are able tocommunicate with the network 402 and with designated sets or groups oftape nodes.

In some examples, the mobile gateway 412 is a vehicle (e.g., a deliverytruck or other mobile hub) that includes a wireless communications unit416 that is configured by the network service 408 to communicate with adesignated set of tape nodes, including a peripheral tape node 418 inthe form of a label that is adhered to an asset 420 contained within aparcel 421 (e.g., an envelope), and is further configured to communicatewith the network service 408 over the network 402. In some examples, theperipheral tape node 418 includes a lower power wireless communicationsinterface of the type used in, e.g., tape node 102 (shown in FIG. 5A),and the wireless communications unit 416 is implemented by a tape node(e.g., one of tape node 103 or tape node 105, respectively shown inFIGS. 5B and 5C) that includes a lower power communications interfacefor communicating with tape nodes within range of the mobile gateway 412and a higher power communications interface for communicating with thenetwork 402. In this way, the tape nodes 418 and 416 create ahierarchical wireless network of nodes for transmitting, forwarding,bridging, relaying, or otherwise communicating wireless messages to,between, or on behalf of the peripheral tape node 418 and the networkservice 408 in a power-efficient and cost-effective way.

In some examples, the mobile gateway 410 is a mobile phone that isoperated by a human operator and executes a client application 422 thatis configured by the network service 408 to communicate with adesignated set of tape nodes, including a master tape node 424 that isadhered to a parcel 426 (e.g., a box), and is further configured tocommunicate with the network service 408 over the network 402. In theillustrated example, the parcel 426 contains a first parcel labeled orsealed by a tape node 428 and containing a first asset 430, and a secondparcel labeled or sealed by a tape node 432 and containing a secondasset 434. As explained in detail below, the master tape node 424communicates with each of the peripheral tape nodes 428, 432 andcommunicates with the mobile gateway 408 in accordance with ahierarchical wireless network of tape nodes. In some examples, each ofthe peripheral tape nodes 428, 432 includes a lower power wirelesscommunications interface of the type used in, e.g., tape node 102 (shownin FIG. 5A), and the master tape node 424 is implemented by a tape node(e.g., tape node 103, shown in FIG. 5B) that includes a lower powercommunications interface for communicating with the peripheral tapenodes 428, 432 contained within the parcel 426, and a higher powercommunications interface for communicating with the mobile gateway 410.The master tape node 424 is operable to relay wireless communicationsbetween the tape nodes 428, 432 contained within the parcel 426 and themobile gateway 410, and the mobile gateway 410 is operable to relaywireless communications between the master tape node 424 and the networkservice 408 over the wireless network 402. In this way, the master tapenode 424 and the peripheral tape nodes 428 and 432 create a hierarchicalwireless network of nodes for transmitting, forwarding, relaying, orotherwise communicating wireless messages to, between, or on behalf ofthe peripheral tape nodes 428, 432 and the network service 408 in apower-efficient and cost-effective way.

In some examples, the stationary gateway 414 is implemented by a serverexecuting a server application that is configured by the network service408 to communicate with a designated set 440 of tape nodes 442, 444,446, 448 that are adhered to respective parcels containing respectiveassets 450, 452, 454, 456 on a pallet 458. In other examples, thestationary gateway 414 is implemented by a tape node (e.g., one of tapenode 103 or tape node 105, respectively shown in FIGS. 5B and 5C) thatis adhered to, for example, a wall, column or other infrastructurecomponent of the environment 400, and includes a lower powercommunications interface for communicating with tape nodes within rangeof the stationary gateway 414 and a higher power communicationsinterface for communicating with the network 402. In one embodiment,each of the tape nodes 442-448 is a peripheral tape node and isconfigured by the network service 408 to communicate individually withthe stationary gateway 414, which relays communications from the tapenodes 442-448 to the network service 408 through the stationary gateway414 and over the communications network 402. In another embodiment, oneof the tape nodes 442-448 at a time is configured as a master tape nodethat transmits, forwards, relays, or otherwise communicate wirelessmessages to, between, or on behalf of the other tape nodes on the pallet458. In this embodiment, the master tape node may be determined by thetape nodes 442-448 or designated by the network service 408. In someexamples, the tape node with the longest range or highest remainingpower level is determined to be the master tape node. In some examples,when the power level of the current master tape node drops below acertain level (e.g., a fixed power threshold level or a threshold levelrelative to the power levels of one or more of the other tape nodes),another one of the tape nodes assumes the role of the master tape node.In some examples, a master tape node 459 is adhered to the pallet 458and is configured to perform the role of a master node for the tapenodes 442-448. In these ways, the tape nodes 442-448, 458 areconfigurable to create different hierarchical wireless networks of nodesfor transmitting, forwarding, relaying, bridging, or otherwisecommunicating wireless messages with the network service 408 through thestationary gateway 414 and over the network 402 in a power-efficient andcost-effective way.

In the illustrated example, the stationary gateway 414 also isconfigured by the network service 408 to communicate with a designatedset of tape nodes, including a master tape node 460 that is adhered tothe inside of a door 462 of a shipping container 464, and is furtherconfigured to communicate with the network service 408 over the network402. In the illustrated example, the shipping container 464 contains anumber of parcels labeled or sealed by respective peripheral tape nodes466 and containing respective assets. The master tape node 416communicates with each of the peripheral tape nodes 466 and communicateswith the stationary gateway 415 in accordance with a hierarchicalwireless network of tape nodes. In some examples, each of the peripheraltape nodes 466 includes a lower power wireless communications interfaceof the type used in, e.g., tape node 102 (shown in FIG. 5A), and themaster tape node 460 is implemented by a tape node (e.g., tape node 103,shown in FIG. 5B) that includes a lower power communications interfacefor communicating with the peripheral tape nodes 466 contained withinthe shipping container 464, and a higher power communications interfacefor communicating with the stationary gateway 414.

In some examples, when the doors of the shipping container 464 areclosed, the master tape node 460 is operable to communicate wirelesslywith the peripheral tape nodes 466 contained within the shippingcontainer 464. In an example, the master tape node 460 is configured tocollect sensor data from the peripheral tape nodes and, in someembodiments, process the collected data to generate, for example, one ormore histograms from the collected data. When the doors of the shippingcontainer 464 are open, the master tape node 460 is programmed to detectthe door opening (e.g., with an accelerometer component of the mastertape node 460) and, in addition to reporting the door opening event tothe network service 408, the master tape node 460 is further programmedto transmit the collected data and/or the processed data in one or morewireless messages to the stationary gateway 414. The stationary gateway414, in turn, is operable to transmit the wireless messages receivedfrom the master tape node 460 to the network service 408 over thewireless network 402. Alternatively, in some examples, the stationarygateway 414 also is operable to perform operations on the data receivedfrom the master tape node 460 with the same type of data produced by themaster node 459 based on sensor data collected from the tape nodes442-448. In this way, the master tape node 460 and the peripheral tapenodes 466 create a hierarchical wireless network of nodes fortransmitting, forwarding, relaying, or otherwise communicating wirelessmessages to, between, or on behalf of the peripheral tape nodes 466 andthe network service 408 in a power-efficient and cost-effective way.

In an example of the embodiment shown in FIG. 7 , there are threeclasses of tape nodes: a short range tape node, a medium range tapenode, and a long range tape node, as respectively shown in FIGS. 5A-5C.The short range tape nodes typically are adhered directly to parcelscontaining assets. In the illustrated example, the tape nodes 418, 428,432, 442-448, 466 are short range tape nodes. The short range tape nodestypically communicate with a low power wireless communication protocol(e.g., Bluetooth LE, Zigbee, or Z-wave). The medium range tape nodestypically are adhered to objects (e.g., a box 426 and a shippingcontainer 460) that are associated with multiple parcels that areseparated from the medium range tape nodes by a barrier or a largedistance. In the illustrated example, the tape nodes 424 and 460 aremedium range tape nodes. The medium range tape nodes typicallycommunicate with a medium power wireless communication protocol (e.g.,LoRa or Wi-Fi). The long-range tape nodes typically are adhered tomobile or stationary infrastructure of the wireless communicationenvironment 400. In the illustrated example, the mobile gateway tapenode 412 and the stationary gateway tape node 414 are long range tapenodes. The long range tape nodes typically communicate with other nodesusing a high power wireless communication protocol (e.g., a cellulardata communication protocol). In some examples, the mobile gateway tapenode 436 is adhered to a mobile vehicle (e.g., a truck). In theseexamples, the mobile gateway 412 may be moved to different locations inthe environment 400 to assist in connecting other tape nodes to theserver 404. In some examples, the stationary gateway tape node 414 maybe attached to a stationary structure (e.g., a wall) in the environment400 with a known geographic location. In these examples, other tapenodes in the environment can determine their geographic location byquerying the gateway tape node 414.

Wireless Communications Network

FIG. 8 shows an example hierarchical wireless communications network oftape nodes 470. In this example, the short range tape node 472 and themedium range tape node 474 communicate with one another over theirrespective low power wireless communication interfaces 476, 478. Themedium range tape node 474 and the long range tape node 480 communicatewith one another over their respective medium power wirelesscommunication interfaces 478, 482. The long range tape node 480 and thenetwork server 404 communicate with one another over the high powerwireless communication interface 484. In some examples, the low powercommunication interfaces 476, 478 establish wireless communications withone another in accordance with the Bluetooth LE protocol, the mediumpower communication interfaces 452, 482 establish wirelesscommunications with one another in accordance with the LoRacommunications protocol, and the high power communication interface 484establishes wireless communications with the server 404 in accordancewith a cellular communications protocol.

In some examples, the different types of tape nodes are deployed atdifferent levels in the communications hierarchy according to theirrespective communications ranges, with the long range tape nodesgenerally at the top of the hierarchy, the medium range tape nodesgenerally in the middle of the hierarchy, and the short range tape nodesgenerally at the bottom of the hierarchy. In some examples, thedifferent types of tape nodes are implemented with different featuresets that are associated with component costs and operational costs thatvary according to their respective levels in the hierarchy. This allowssystem administrators flexibility to optimize the deployment of the tapenodes to achieve various objectives, including cost minimization, assettracking, asset localization, and power conservation.

In some examples, a server 404 of the network service 408 designates atape node at a higher level in a hierarchical communications network asa master node of a designated set of tape nodes at a lower level in thehierarchical communications network. For example, the designated mastertape node may be adhered to a parcel (e.g., a box, pallet, or shippingcontainer) that contains one or more tape nodes that are adhered to oneor more assets containing respective assets. In order to conserve power,the tape nodes typically communicate according to a schedule promulgatedby the server 404 of the network service 408. The schedule usuallydictates all aspects of the communication, including the times whenparticular tape nodes should communicate, the mode of communication, andthe contents of the communication. In one example, the server 404transmits programmatic Global Scheduling Description Language (GSDL)code to the master tape node and each of the lower-level tape nodes inthe designated set. In this example, execution of the GSDL code causeseach of the tape nodes in the designated set to connect to the mastertape node at a different respective time that is specified in the GSDLcode, and to communicate a respective set of one or more data packets ofone or more specified types of information over the respectiveconnection. In some examples, the master tape node simply forwards thedata packets to the server network node 404, either directly orindirectly through a gateway tape node (e.g., the long range tape node416 adhered to the mobile vehicle 412 or the long range tape node 414adhered to an infrastructure component of the environment 400). In otherexamples, the master tape node processes the information contained inthe received data packets and transmits the processed information to theserver network node 404.

FIG. 9 shows an example method of creating a hierarchical communicationsnetwork. In accordance with this method, a first tape node is adhered toa first asset in a set of associated assets, the first tape nodeincluding a first type of wireless communication interface and a secondtype of wireless communication interface having a longer range than thefirst type of wireless communication interface (FIG. 9 , block 490). Asecond tape node is adhered to a second asset in the set, the secondtape node including the first type of wireless communication interface,wherein the second tape node is operable to communicate with the firsttape node over a wireless communication connection established betweenthe first type of wireless communication interfaces of the first andsecond tape nodes (FIG. 9 , block 492). An application executing on acomputer system (e.g., a server 404 of a network service 408)establishes a wireless communication connection with the second type ofwireless communication interface of the first tape node, and theapplication transmits programmatic code executable by the first tapenode to function as a master tape node with respect to the second tapenode (FIG. 9 , block 494).

In other embodiments, the second tape node is assigned the role of themaster node of the first tape node.

Distributed Agent Operating System

As used herein, the term “node” refers to both a tape node and anon-tape node (i.e., a node or wireless device that is not an adhesivetape platform) unless the node is explicitly designated as a “tape node”or a “non-tape node.” In some embodiments, a non-tape node may have thesame or similar communication, sensing, processing and otherfunctionalities and capabilities as the tape nodes described herein,except without being integrated into a tape platform. In someembodiments, non-tape nodes can interact seamlessly with tape nodes.Each node may be assigned a respective unique identifier, according tosome embodiments.

The following disclosure describes a distributed software operatingsystem that is implemented by distributed hardware nodes executingintelligent agent software to perform various tasks or algorithms. Insome embodiments, the operating system distributes functionalities(e.g., performing analytics on data or statistics collected or generatedby nodes) geographically across multiple intelligent agents that arebound to items (e.g., parcels, containers, packages, boxes, pallets, aloading dock, a door, a light switch, a vehicle such as a deliverytruck, a shipping facility, a port, a hub, etc.). In addition, theoperating system dynamically allocates the hierarchical roles (e.g.,master and slave roles) that nodes perform over time in order to improvesystem performance, such as optimizing battery life across nodes,improving responsiveness, and achieving overall objectives. In someembodiments, optimization is achieved using a simulation environment foroptimizing key performance indicators (PKIs).

In some embodiments, the nodes are programmed to operate individually orcollectively as autonomous intelligent agents. In some embodiments,nodes are configured to communicate and coordinate actions and respondto events. In some embodiments, a node is characterized by its identity,its mission, and the services that it can provide to other nodes. Anode's identity is defined by its capabilities (e.g., battery life,sensing capabilities, and communications interfaces). A node's mission(or objective) is defined by the respective program code, instructions,or directives it receives from another node (e.g., a server or a masternode) and the actions or tasks that it performs in accordance with thatprogram code, instructions, or directives (e.g., sense temperature everyhour and send temperature data to a master node to upload to a server).A node's services define the functions or tasks that it is permitted toperform for other nodes (e.g., retrieve temperature data from aperipheral node and send the received temperature data to the server).At least for certain tasks, once programmed and configured with theiridentities, missions, and services, nodes can communicate with oneanother and request services from and provide services to one anotherindependently of the server.

Thus, in accordance with the runtime operating system every agent knowsits objectives (programmed). Every agent knows whichcapabilities/resources it needs to fulfill objective. Every agentcommunicates with every other node in proximity to see if it can offerthe capability. Examples include communicate data to the server,authorize going to lower power level, temperature reading, send an alertto local hub, send location data, triangulate location, any boxes insame group that already completed group objectives.

Nodes can be associated with items. Examples of an item includes, butare not limited to for example, a package, a box, pallet, a container, atruck or other conveyance, infrastructure such as a door, a conveyorbelt, a light switch, a road, or any other thing that can be tracked,monitored, sensed, etc. or that can transmit data concerning its stateor environment. In some examples, a server or a master node mayassociate the unique node identifiers with the items.

Communication paths between tape and/or non-tape nodes may berepresented by a graph of edges between the corresponding assets (e.g.,a storage unit, truck, or hub). In some embodiments, each node in thegraph has a unique identifier. A set of connected edges between nodes isrepresented by a sequence of the node identifiers that defines acommunication path between a set of nodes.

Referring to FIG. 10A, a node 520 (Node A) is associated with an asset522 (Asset A). In some embodiments, the node 520 may be implemented as atape node that is used to seal the asset 522 or it may be implemented asa label node that is used to label the asset 522; alternatively, thenode 520 may be implemented as a non-tape node that is inserted withinthe asset 522 or embedded in or otherwise attached to the interior orexterior of the asset 522. In the illustrated embodiment, the node 520includes a low power communications interface 524 (e.g., a Bluetooth LowEnergy communications interface). Another node 526 (Node B), which isassociated with another asset 530 (Asset B), is similarly equipped witha compatible low power communications interface 528 (e.g., a BluetoothLow Energy communications interface).

In an example scenario, in accordance with the programmatic code storedin its memory, node 526 (Node B) requires a connection to node 520 (NodeA) to perform a task that involves checking the battery life of Node A.Initially, Node B is unconnected to any other nodes. In accordance withthe programmatic code stored in its memory, Node B periodicallybroadcasts advertising packets into the surrounding area. When the othernode 520 (Node A) is within range of Node B and is operating in alistening mode, Node A will extract the address of Node B andpotentially other information (e.g., security information) from anadvertising packet. If, according to its programmatic code, Node Adetermines that it is authorized to connect to Node B, Node A willattempt to pair with Node B. In this process, Node A and Node Bdetermine each other's identities, capabilities, and services. Forexample, after successfully establishing a communication path 532 withNode A (e.g., a Bluetooth Low Energy formatted communication path), NodeB determines Node A's identity information (e.g., master node), Node A'scapabilities include reporting its current battery life, and Node A'sservices include transmitting its current battery life to other nodes.In response to a request from Node B, Node A transmits an indication ofits current battery life to Node B.

Referring to FIG. 10B, a node 534 (Node C) is associated with an asset535 (Asset C). In the illustrated embodiment, the Node C includes a lowpower communications interface 536 (e.g., a Bluetooth Low Energycommunications interface), and a sensor 537 (e.g., a temperaturesensor). Another node 538 (Node D), which is associated with anotherasset 540 (Asset D), is similarly equipped with a compatible low powercommunications interface 542 (e.g., a Bluetooth Low Energycommunications interface).

In an example scenario, in accordance with the programmatic code storedin its memory, Node D requires a connection to Node C to perform a taskthat involves checking the temperature in the vicinity of Node C.Initially, Node D is unconnected to any other nodes. In accordance withthe programmatic code stored in its memory, Node D periodicallybroadcasts advertising packets in the surrounding area. When Node C iswithin range of Node D and is operating in a listening mode, Node C willextract the address of Node D and potentially other information (e.g.,security information) from the advertising packet. If, according to itsprogrammatic code, Node C determines that it is authorized to connect toNode D, Node C will attempt to pair with Node D. In this process, Node Cand Node D determine each other's identities, capabilities, andservices. For example, after successfully establishing a communicationpath 544 with Node C (e.g., a Bluetooth Low Energy formattedcommunication path), Node D determines Node C's identity information(e.g., a peripheral node), Node C's capabilities include retrievingtemperature data, and Node C's services include transmitting temperaturedata to other nodes. In response to a request from Node D, Node Ctransmits its measured and/or locally processed temperature data to NodeD.

Referring to FIG. 10C, a pallet 550 is associated with a master node 551that includes a low power communications interface 552, a GPS receiver554, and a cellular communications interface 556. In some embodiments,the master node 551 may be implemented as a tape node or a label nodethat is adhered to the pallet 550. In other embodiments, the master node551 may be implemented as a non-tape node that is inserted within thebody of the pallet 550 or embedded in or otherwise attached to theinterior or exterior of the pallet 550.

The pallet 550 provides a structure for grouping and containing assets559, 561, 563 each of which is associated with a respective peripheralnode 558, 560, 562 (Node E, Node F, and Node G). Each of the peripheralnodes 558, 560, 562 includes a respective low power communicationsinterface 564, 566, 568 (e.g., Bluetooth Low Energy communicationsinterface). In the illustrated embodiment, each of the nodes E, F, G andthe master node 551 are connected to each of the other nodes over arespective low power communications path (shown by dashed lines).

In some embodiments, the assets 559, 561, 563 are grouped togetherbecause they are related. For example, the assets 559, 561, 563 mayshare the same shipping itinerary or a portion thereof. In an examplescenario, the master pallet node 550 scans for advertising packets thatare broadcasted from the peripheral nodes 558, 560, 562. In someexamples, the peripheral nodes broadcast advertising packets duringrespective scheduled broadcast intervals. The master node 551 candetermine the presence of the assets 559, 561, 563 in the vicinity ofthe pallet 550 based on receipt of one or more advertising packets fromeach of the nodes E, F, and G. In some embodiments, in response toreceipt of advertising packets broadcasted by the peripheral nodes 558,560, 562, the master node 551 transmits respective requests to theserver to associate the master node 551 and the respective peripheralnodes 558, 560, 562. In some examples, the master tape node requestsauthorization from the server to associate the master tape node and theperipheral tape nodes. If the corresponding assets 559, 561, 563 areintended to be grouped together (e.g., they share the same itinerary orcertain segments of the same itinerary), the server authorizes themaster node 551 to associate the peripheral nodes 558, 560, 562 with oneanother as a grouped set of assets. In some embodiments, the serverregisters the master node and peripheral tape node identifiers with agroup identifier. The server also may associate each node ID with arespective physical label ID that is affixed to the respective asset.

In some embodiments, after an initial set of assets is assigned to amulti-asset group, the master node 551 may identify another assetarrives in the vicinity of the multi-asset group. The master node mayrequest authorization from the server to associate the other asset withthe existing multi-asset group. If the server determines that the otherasset is intended to ship with the multi-asset group, the serverinstructs the master node to merge one or more other assets withcurrently grouped set of assets. After all assets are grouped together,the server authorizes the multi-asset group to ship. In someembodiments, this process may involve releasing the multi-asset groupfrom a containment area (e.g., customs holding area) in a shipmentfacility.

In some embodiments, the peripheral nodes 558, 560, 562 includeenvironmental sensors for obtaining information regarding environmentalconditions in the vicinity of the associated assets 559, 561, 563.Examples of such environmental sensors include temperature sensors,humidity sensors, acceleration sensors, vibration sensors, shocksensors, pressure sensors, altitude sensors, light sensors, andorientation sensors.

In the illustrated embodiment, the master node 551 can determine its ownlocation based on geolocation data transmitted by a satellite-basedradio navigation system 570 (e.g., GPS, GLONASS, and NAVSTAR) andreceived by the GPS receiver 554 component of the master node 551. In analternative embodiment, the location of the master pallet node 551 canbe determined using cellular based navigation techniques that use mobilecommunication technologies (e.g., GSM, GPRS, CDMA, etc.) to implementone or more cell-based localization techniques. After the master node551 has ascertained its location, the distance of each of the assets559, 561, 563 from the master node 551 can be estimated based on theaverage signal strength of the advertising packets that the master node551 receives from the respective peripheral node. The master node 551can then transmit its own location and the locations of the asset nodesE, F, and G to a server over a cellular interface connection with a celltower 572. Other methods of determining the distance of each of theassets 559, 561, 563 from the master node 551, such as ReceivedSignal-Strength Index (RSSI) based indoor localization techniques, alsomay be used.

In some embodiments, after determining its own location and thelocations of the peripheral nodes, the master node 551 reports thelocation data and the collected and optionally processed (e.g., eitherby the peripheral nodes peripheral nodes 558, 560, 562 or the masternode 551) sensor data to a server over a cellular communication path 571on a cellular network 572.

In some examples, nodes are able to autonomously detect logisticsexecution errors if assets that suppose to travel together no longertravel together, and raise an alert. For example, a node (e.g., themaster node 551 or one of the peripheral nodes 558, 560, 562) alerts theserver when the node determines that a particular asset 559 is being orhas already been improperly separated from the group of assets. The nodemay determine that there has been an improper separation of theparticular asset 559 in a variety of ways. For example, the associatednode 558 that is bound to the particular asset 559 may include anaccelerometer that generates a signal in response to movement of theasset from the pallet. In accordance with its intelligent agent programcode, the associated node 558 determines that the master node 551 hasnot disassociated the particular asset 559 from the group and thereforebroadcasts advertising packets to the master node, which causes themaster node 551 to monitor the average signal strength of theadvertising packets and, if the master node 551 determines that thesignal strength is decreasing over time, the master node 551 will issuean alert either locally (e.g., through a speaker component of the masternode 551) or to the server.

Referring to FIG. 10D, a truck 580 is configured as a mobile node ormobile hub that includes a cellular communications interface 582, amedium power communications interface 584, and a low powercommunications interface 586. The communications interfaces 580-586 maybe implemented on one or more tape and non-tape nodes. In anillustrative scenario, the truck 580 visits a storage facility, such asa warehouse 588, to wirelessly obtain temperature data generated bytemperature sensors in the medium range nodes 590, 592, 594. Thewarehouse 588 contains nodes 590, 592, and 594 that are associated withrespective assets 591, 593, 595. In the illustrated embodiment, eachnode 590-594 is a medium range node that includes a respective mediumpower communications interface 596, 602, 608, a respective low powercommunications interface 598, 604, 610 and one or more respectivesensors 600, 606, 612. In the illustrated embodiment, each of the assetnodes 590, 592, 594 and the truck 580 is connected to each of the otherones of the asset nodes through a respective medium power communicationspath (shown by dashed lines). In some embodiments, the medium powercommunications paths are LoRa formatted communication paths.

In some embodiments, the communications interfaces 584 and 586 (e.g., aLoRa communications interface and a Bluetooth Low Energy communicationsinterface) on the node on the truck 580 is programmed to broadcastadvertisement packets to establish connections with other network nodeswithin range of the truck node. A warehouse 588 includes medium rangenodes 590, 592, 594 that are associated with respective containers 591,593, 595 (e.g., assets, boxes, pallets, and the like). When the trucknode's low power interface 586 is within range of any of the mediumrange nodes 590, 592, 594 and one or more of the medium range nodes isoperating in a listening mode, the medium range node will extract theaddress of truck node and potentially other information (e.g., securityinformation) from the advertising packet. If, according to itsprogrammatic code, the truck node determines that it is authorized toconnect to one of the medium range nodes 590, 592, 594, the truck nodewill attempt to pair with the medium range node. In this process, thetruck node and the medium range node determine each other's identities,capabilities, and services. For example, after successfully establishinga communication path with the truck node (e.g., a Bluetooth Low Energyformatted communication path 614 or a LoRa formatted communication path617), the truck node determines the identity information for the mediumrange node 590 (e.g., a peripheral node), the medium range node'scapabilities include retrieving temperature data, and the medium rangenode's services include transmitting temperature data to other nodes.Depending of the size of the warehouse 588, the truck 580 initially maycommunicate with the nodes 590, 592, 594 using a low powercommunications interface (e.g., Bluetooth Low Energy interface). If anyof the anticipated nodes fails to respond to repeated broadcasts ofadvertising packets by the truck 580, the truck 580 will try tocommunicate with the non-responsive nodes using a medium powercommunications interface (e.g., LoRa interface). In response to arequest from the truck node 584, the medium range node 590 transmits anindication of its measured temperature data to the truck node. The trucknode repeats the process for each of the other medium range nodes 592,594 that generate temperature measurement data in the warehouse 588. Thetruck node reports the collected (and optionally processed, either bythe medium range nodes 590, 592, 594 or the truck node) temperature datato a server over a cellular communication path 616 with a cellularnetwork 618.

Referring to FIG. 10E, a master node 630 is associated with an item 632(e.g., an asset) and grouped together with other items 634, 636 (e.g.,assets) that are associated with respective peripheral nodes 638, 640.The master node 630 includes a GPS receiver 642, a medium powercommunications interface 644, one or more sensors 646, and a cellularcommunications interface 648. Each of the peripheral nodes 638, 640includes a respective medium power communications interface 650, 652 andone or more respective sensors 654, 656. In the illustrated embodiment,the peripheral and master nodes are connected to one another other overrespective pairwise communications paths (shown by dashed lines). Insome embodiments, the nodes 630 638, 640 communicate through respectiveLoRa communications interfaces over LoRa formatted communications paths658, 660, 662.

In the illustrated embodiment, the master and peripheral nodes 638, 638,640 include environmental sensors for obtaining information regardingenvironmental conditions in the vicinity of the associated assets 632,634, 636. Examples of such environmental sensors include temperaturesensors, humidity sensors, acceleration sensors, vibration sensors,shock sensors, pressure sensors, altitude sensors, light sensors, andorientation sensors.

In accordance with the programmatic code stored in its memory, themaster node 630 periodically broadcasts advertising packets in thesurrounding area. When the peripheral nodes 638, 640 are within range ofmaster node 630, and are operating in a listening mode, the peripheralnodes 638, 640 will extract the address of master node 630 andpotentially other information (e.g., security information) from theadvertising packets. If, according to their respective programmaticcode, the peripheral nodes 638, 640 determine that hey are authorized toconnect to the master node 630, the peripheral nodes 638, 640 willattempt to pair with the master node 630. In this process, theperipheral nodes 638, 640 and the master node and the peripheral nodesdetermine each other's identities, capabilities, and services. Forexample, after successfully establishing a respective communication path658, 660 with each of the peripheral nodes 638, 640 (e.g., a LoRaformatted communication path), the master node 630 determines certaininformation about the peripheral nodes 638, 640, such as their identityinformation (e.g., peripheral nodes), their capabilities (e.g.,measuring temperature data), and their services include transmittingtemperature data to other nodes.

After establishing LoRa formatted communications paths 658, 660 with theperipheral nodes 638, 640, the master node 630 transmits requests forthe peripheral nodes 638, 640 to transmit their measured and/or locallyprocessed temperature data to the master node 630.

In the illustrated embodiment, the master node 630 can determine its ownlocation based on geolocation data transmitted by a satellite-basedradio navigation system 666 (e.g., GPS, GLONASS, and NAVSTAR) andreceived by the GPS receiver 642 component of the master node 630. In analternative embodiment, the location of the master node 630 can bedetermined using cellular based navigation techniques that use mobilecommunication technologies (e.g., GSM, GPRS, CDMA, etc.) to implementone or more cell-based localization techniques. After the master node630 has ascertained its location, the distance of each of the assets634, 636 from the master node 630 can be estimated based on the averagesignal strength of the advertising packets that the master node 630receives from the respective peripheral node. The master node 630 canthen transmit its own location and the locations of the asset nodes E,F, and G to a server over a cellular interface connection with a celltower 672. Other methods of determining the distance of each of theassets 634, 636 from the master node 630, such as ReceivedSignal-Strength Index (RSSI) based indoor localization techniques, alsomay be used.

In some embodiments, after determining its own location and thelocations of the peripheral nodes, the master node 630 reports thelocation data the collected and optionally processed (e.g., either bythe peripheral nodes peripheral nodes 634, 636 or the master node 630)sensor data to a server over a cellular communication path 670 on acellular network 672.

Flexible Tracking Device for Cables and Equipment

Disclosed herein is a tracking device which is an embodiment of theadhesive tape platform (tape node), as described above with respect toFIGS. 1-6C. The tracking device can be bent a full 180° or more at abending portion of the tracking device, without damage occurring toelectronics components or in the device layer 122 and the energy storage92 of the tape node. The tracking device is configured to bend or wraparound an object and track the object. For example, the tracking devicemay be bent or wrapped around a cable or cord and afterward track thelocation and/or condition of the cable or cord. The tracking device mayinclude components of the wireless transducing circuit 70, according tosome embodiments. The tracking device may also include an adhesive on anadhesive side of the tracking device, which allows for the trackingdevice to adhere to the object or to adhere to itself, which secures thetracking device to the object. Embodiments of the tracking device arediscussed below, with respect to FIGS. 11A-15B.

FIG. 11A shows an embodiment of the tracking device (tape node) 1101,according to some embodiments. The tape node 1101 includes a circuitcomponent region 1120 on one side of a bending region 1115 and an energystorage region 1130 on the other side of the bending region. Electroniccomponents disposed in the tape node 1101 overlap the circuit componentregion 1120, but do not overlap the bending region 1115. Similarly,energy storage components such as energy storage 92 or a battery overlapan energy storage region 1130, but do not overlap the bending region1115. The energy storage region 1130 and the circuit component region1120 may each include portions of the flexible circuit 116 or separateflexible circuits 116. Thus, the bending region 1115 does not overlapwith any components that are sensitive to bending and would be damagedby being bent with a high bend angle, and the tape node 1110 may be bentto a high degree at the bending region 1115 without excessive strain orphysical stress being applied to sensitive or critical electronic ormechanical components of the tape node 1101

A bending guideline 1110 appears on the non-adhesive side (shown in FIG.11A) of the tape node 1101, according to some embodiments. The bendingguideline 1110 is a visual indicator for guiding a user to bend the tapenode 1101 in the bending region 1115 when installing and using the tapenode 1101. The bending guideline 1110 may be printed on the cover layer128 of the tape node 1101. The tape node 1101 may include other graphicsor text that appear on the tape node 1101, besides the guideline 1110.For example, the tape node 1101 may display text instruction guiding auser to bend the tape node at the bending guideline 1110. In someembodiments, additional markings (e.g., the two-dimensional barcode 22)are on the non-adhesive side of the tape node 110. In some embodiments,the tape node 1101 does not include the guideline 1120.

FIG. 11B is a cross-sectional diagram of the tape node 1101 shown inFIG. 11A along the line A-A′, according to some embodiments. The tapenode 1101, internally includes some combination of the componentsdescribed above with regards to the tape nodes 102, 103, 105 shown inFIGS. 5A-5C. The tape node 11101 includes a flexible substrate 1150which overlaps the entire tape node 1101, according to some embodiments.The tape node 1101 also includes a fa flexible circuit 116, an energystorage 92, a connection part 1140, a device layer 122 with componentsconnected to the flexible circuit 116, and cover layers 1140 that coverthe device layer 122, the connection part 1140, the flexible circuit116, the energy storage 92, and the flexible substrate 1150. In someembodiments, the flexible cover layer overlaps the entire tape node1101. In the example shown in FIG. 11B, the device layer 122 andcomponents of the device layer 122 except the energy storage 92 arepositioned in the circuit component region. The circuit component region1120 includes the flexible circuit 116 which connects the components ofthe device layer 122, according to some embodiments. The energy storage92 (e.g., a battery or flexible battery) is positioned in the energystorage region 1130.

The flexible substrate 1150 include some combination of the layers 112,110 shown in FIGS. 5A-5C, and other layers, according to someembodiments. The cover layers 1140 include some combination of thelayers 122, 128 shown in FIGS. 5A-5C, and other layers, according tosome embodiments. The adhesive 114 on the bottom side of the flexiblesubstrate 1150 allows for the tape node 1110 to adhere to an object thatis being tracked or for portions of the tape node 1101 to adhere to thetape node 1101 itself, as shown in FIG. 11C.

The bending region 1115 of the tape node 1101 is a region where the tapenode is configured to bend up to 180°. In some embodiments, the tapenode 11101 is configured to bent more than 180° at the bending region1115. A connection part 1140 is positioned in the bending region 1115that electrically connects components (and optionally a flexible circuit116) in the energy storage region (e.g., the energy storage 92) to theflexible circuit 116 of the circuit component region 1120. In someembodiments, the connection part 1140 includes one or more flexibleconductive traces that connect components in the two regions 1120, 1130.The connection part 1140 may include one or more metal conductivetraces, other types of conductive traces, conductive wiring, anelectrical connector, some other flexible electrically conductivecomponent, or some combination thereof. The connection part 1140 is alsoconfigured to provide mechanical stability and support in the bendingregion, according to some embodiments. For example, the connection part1140 may be configured to guide the bending of the tape node 1140 when auser folds or bends the tape node 1101 around an object. In someembodiments, the tape node 1140 is twisted in the bending region and theconnection part 1140 is configured to withstand a twisting motion by auser. In some embodiments, the connection part 1140 includes a thinstrip of metal that can be bent and that extends from the circuitcomponent region, extends through the bending region, and connects tothe energy storage region. The thin strip of metal may include, forexample, an aluminum material, a stainless-steel material, a galvanizedsteel material, a gold or gold alloy material, a silver or silver alloymaterial, a copper material, another conductive material, or somecombination thereof. In some embodiments, the connection part 1140includes a portion that is not conductive, with conductive traces (whichmay be flexible) on the portion that electrically connect components inthe energy storage region 1130 to the components in the circuitcomponent region 1120. The connection part has a rigidity or stiffnessthat is higher than a rigidity or stiffness of the flexible substratelayer 110 and/or the cover layer 128, according to some embodiments.

In some embodiments, the components of the tape node, the device layer122, and the energy storage 92 are distributed differently across theelectronic component region 1120, the energy storage region 1130, andthe bending region than is shown in FIG. 11B. For example, the energystorage region may include some combination of a portion of the devicelayer 122, a portion of the flexible circuit 116, and one or moreelectronic components of the device layer 122, such as a processor ormemory. Also, the electronic component region may include one or moreenergy storage components (e.g., batteries). In some embodiments, thebending region includes one or more flexible electronic components thatcan withstand up to 180° bending without damaging the electroniccomponents.

In some embodiments the distribution and layout of the components of thetape node 1101 is determined using an electronic design automation (EDA)or a computer-assisted design (CAD) tool. The EDA tool or CAD tool maydetermine the distribution and layout based on the electronic componentsof the tape node 1101, the electrical connections between the electroniccomponents, the pathing of the electrical connections, the shape of thetape node 1101, and the bending tolerance of each of the electroniccomponents. The EDA tool or CAD tool may determine the distribution andlayout of the components of the tape node 1101 by optimizing thesefactors.

In some embodiments, a support layer (not shown) may be disposed in thetape node 1101 that provides support, protection, and/or rigidity in thecircuit component region 1120 and the energy storage region 1130. Thesupport layer, for example may include a rigid or semi-rigid material.The support layer has a rigidity or stiffness that is higher than arigidity or stiffness of the substrate layers and/or the cover layers.The support layer may be positioned to overlap the bending region 1115,according to some embodiments. In further embodiments, the support layeris positioned to only overlap the bending region, reinforcing the partof the tape node 1101 that undergoes the bending.

FIG. 11C shows the tracking device 1101 wrapped around a portion of acable 1102 for tracking the cable, according to some embodiments. Thetape node 1101 is bent a full 180° at the bending region 1115 around thecable 1102. The tape node 1101 is effectively folded at the bendingregion, with the adhesive side in the circuit component region 1120contacting and adhering to the adhesive side in the energy storageregion 1130. The tape node 1101 adheres to itself and may alsooptionally adhere to portions of the cable 1102 to secure the tape node1110 to the cable 1102. The tape node 1101 is easily installed on thecable 1102 by a human operator, due to the flexible form factor of thetape node 1101, the distribution of the components in the circuitcomponent region 1120, the bending region, and the energy storage region1130, and the connection part 1140, which allows the tape node 1101 tobe bent and/or folded up to 180° without damaging the electronicscomponents of the tape node 1101. After the tape node 1110 is installedon the cable 1102, as shown in FIG. 0.11C, the tape node 1110 isconfigured to track the cable 1102, according to some embodiments. Thetape node 1110 may wirelessly communicate with other wireless nodes ofthe tracking system 400 to determine a location of the cable 1102,report a location of the cable 1102, transmit data (e.g., sensor datafrom a sensor of the tape node 1101), receive data, performcomputational tasks for the tracking system 400, perform communicationsfor the tracking system 400, perform other functions, or somecombination thereof. In some embodiments, the tape node 1101 is used tomonitor the location of the cable 1102, as discussed above for variousembodiments of tape nodes and agents of the tracking system 400 withrespect to FIGS. 7-10C.

FIG. 12A shows an embodiment of the tracking device (tape node) 1201,according to some embodiments. The tape node 1201 is substantiallysimilar to the tape node 1101, except that a width of the tape node atthe bending region 1240 is smaller than each of a width of the tape node1101 at a circuit component region 1220 and a width of the tape node1101 at an energy storage region 1230. The tape node 1201 includes acircuit component region 1220 on one side of a bending region and anenergy storage region 1230 on the other side of the bending region. Thecircuit component region 1220 is substantially similar to the circuitcomponent region 1120, and the energy storage region 1230 issubstantially similar to the energy storage region 1130. A bendingguideline appears on the non-adhesive side (not shown in FIG. 12A) ofthe tape node 1201 in the bending region 1240, according to someembodiments. The tape node 1201 may also include additional text andgraphics not shown in FIG. 12A. For example, the tape node 1201 maydisplay text instructions for guiding a user to bend the tape node atthe bending region 1240. In some embodiments, additional markings (e.g.,the two-dimensional barcode 22) are on the non-adhesive side of the tapenode 1201. In some embodiments, the tape node 1201 does not include thebending guideline, as shown in FIG. 12A.

The smaller width of the bending region 1240 may allow easier bendingand installation of the tape node 1201 on objects that have a smallradius, according to some embodiments. In such cases, the tape node 1201may be bent or wrapped around a portion of the object at the bendingregion 1240, as illustrated in FIG. 12C. The smaller width of the tapenode 1201 at the bending region 1240 may provide higher overallflexibility of the tape node 1201 at the bending region 1240.

FIG. 12B is a cross-sectional diagram of the tape node 1201 shown inFIG. 12A along the line A-A′, according to some embodiments. Theinternal components of the tape node 1201 shown in FIG. 12B are the sameas the internal components of the tape node 1101 shown in FIG. 11B. Thetape node 1201 internally includes some combination of the componentsdescribed above with regards to the tape nodes 102, 103, 105 shown inFIGS. 5A-5C. In the example shown in FIG. 12B, the device layer 122 andcomponents of the device layer 122 except the energy storage 92 arepositioned in the circuit component region 1220. The circuit componentregion 1120 includes the flexible circuit 116 which connects thecomponents of the device layer 122, according to some embodiments. Theenergy storage 92 (e.g., a battery or flexible battery) are positionedin the energy storage region 1230.

The flexible substrate layers 1150 include some combination of thelayers 112, 114, 110 shown in FIGS. 5A-5C, and other layers, accordingto some embodiments. The cover layers 1140 include some combination ofthe layers 122, 128 shown in FIGS. 5A-5C, and other layers, according tosome embodiments.

The bending region 1240 of the tape node 1201 is a region where the tapenode is configured to bend up to 180°. The bending region includes aconnection part 1250 that electrically connects components (andoptionally a flexible circuit) in the energy storage region (e.g., theenergy storage 92) to the flexible circuit 116 of the circuit componentregion. The connection part 1250 is an embodiment of the connection part1140. The connection part 1250 has a width smaller than a width of thetape node in the circuit component region 1220 and a width of the tapenode 1201 in the energy storage region 1130. The connection part 1250 isalso configured to provide mechanical stability and support in thebending region 1240. For example, the connection part 1250 may beconfigured to guide the bending of the tape node 1201 when a user foldsor bends the tape node 1201 around an object. In some embodiments, thetape node 1201 is twisted in the bending region and the connection part1250 is configured to withstand a twisting motion by a user. In someembodiments, the connection part includes a thin strip of metal thatextends from the circuit component region through the bending region andreaches the energy storage region. The thin strip of metal may include,for example, an aluminum material, a stainless steel material, a coppermaterial, another conductive material, or some combination thereof. Insome embodiments, the connection part 1140 includes a portion that isnot conductive, with conductive traces (which may be flexible) on theportion that electrically connect components in the energy storageregion 1130 to the components in the circuit component region 1120.

In some embodiments, the components of the tape node, the device layer122, and the energy storage 92 are distributed differently across theelectronic component region, the energy storage region, and the bendingregion than is shown in FIG. 12B. For example, the energy storage regionmay include some combination of a portion of the device layer 122, aportion of the flexible circuit 116, and one or more electroniccomponents of the device layer 122, such as a processor or memory. Also,the electronic component region may include one or more energy storagecomponents (e.g., batteries). In some embodiments, the bending regionincludes one or more electronic components that can withstand up to 180°bending without damaging the electronic components.

FIG. 12C shows the tracking device 1201 wrapped around a portion of acable 1202 for tracking the cable, according to some embodiments. Thetape node 1201 is bent a full 180° at the bending region around thecable 1202. The tape node 1201 is effectively folded at the bendingregion, with the adhesive side in the circuit component region 1220contacting and adhering to the adhesive side in the energy storageregion 1230. The tape node 1201 adheres to itself to secure the tapenode 1201 to the cable 1202 using the adhesive 114. In some embodiments,the tape node may also adhere to the cable. The tape node 1201 is easilyinstalled on the cable 1102 by a human operator, due to the flexibleform factor of the tape node 1201, the distribution of the components inthe circuit component region 1220, the bending region 1240, and theenergy storage region 1230, and the connection part 1250, whichcollectively enable the tape node 1201 to be bent and/or folded up to180° without damaging the electronics components of the tape node 1201.

In some embodiments the tape node 1201 is wrapped around a portion ofone or more parts of a tool and is configured to detect tampering orchanges made to the one or more parts. The tool may include industrialmachinery, a vehicle, an asset, a power tool, an electronic device, someother asset, or some combination thereof. The one or more parts mayinclude an adjustable knob, an adjustable dial, a door, a handle, a key,an ignition, a button, some other input for the tool, a panel of thetool, some other part of the tool, or some combination thereof.

The tampering or changes made to the one or more parts may includechanging a setting of the one or more parts, according to someembodiments. In other embodiments, the tampering or changes includemoving the one or more parts. In some embodiments, the tampering orchanges include breaking or damaging the one or more parts.

The tracking system 400 associated with the tape node 1201, in thisexample, is configured to detect the tampering or changes based on datacollected by the tape node 1201 and/or communications from the tape node1201. For example, the tape node 1201 may be wrapped around one or moreknobs of a tool and configured to detect that the position of the one ormore knobs, which correspond to settings of the tool, has changed. Thetape node 1201 may detect the change based on a sensor that is in thetape node 1201. In some embodiments the tape node 1201 detects thechange by detecting motion using an accelerometer, a vibration sensor, amotion sensor, a velocity sensor, some other method of detecting motion,or some combination thereof. Alternatively, a portion of the tape node1201 (e.g., the bending portion 1240) is configured to break or tearapart from other portions of the tape node 1201 when the position of theone or more knobs is changed. The tape node 1201 may proceed totransmitting a signal to the associated system in response to thebreaking or tearing. In other embodiments, the tape node 1201 ceases tofunction properly after the breaking or tearing, and the systemdetermines that the position of the one or more knobs is changed basedon detecting that the tape node 1201 is no longer functioning properly(e.g., by detecting that the tape node 1201 is no longer communicating asignal to the system).

FIG. 13 is a diagram showing an embodiment of a tape node 1301 with aport for passing an object through the tape node, according to someembodiments. The tape node 1301 is an embodiment of the tape node 102,103, 105 shown in FIGS. 5A-5C. The tape node 1301 includes a port 1310which is a hole through the thickness of the tape node 1301 that allowsobjects to pass through the tape node 1301. In the example shown in FIG.13 a cable 1302 is threaded through the port 1310, and the tape node issecured to the cable 1302. The port may be in a position that does notoverlap with any of the components of the device layer 122 and theenergy storage 92, according to some embodiments. In some embodiments,the tape node 1301 is secured to the cable 1302 using a fastener whichis threaded through the port 1310 and fastened to the cable 1302. Thefastener may include a zip-tie, an adhesive, an adhesive tape, a rope orthread, some other fastener for of securing the tape node 1301 to thecable 1302, or some combination thereof.

FIGS. 14A-14B are exemplary diagrams showing a tracking device 14101including a twisting portion 1410 configured for twisting and wrappingaround an object to be tracked, according to some embodiments. FIG. 14Ashows the tape node 1401 with the twisting portion 1410 twisted around acable 1402. The twisting portion 1410 is twisted around the cable 1402to secure the tape node 1401 to the cable 1402. Although an example of acable 1402 is shown in FIG. 14A, the tape node 1401 may be secured toany object for tracking the object.

FIG. 14B shows a top-down view of the tape node 1401, according to someembodiments. The tape node 1401 is an embodiment of the adhesive tapeplatform 12, 30, 100 shown in FIGS. 1A-1B, 2-4 , and 5A-5C, according tosome embodiments. The tape node 1401 includes the twisting portion 1410and a main body portion 1420, which makes up the rest of the tape node1401. The main body portion 1420 includes the wireless transducingcircuit 70 and the two-dimensional barcode 22 printed on the top surfaceof the flexible cover layer of the tape node 1401. The size of thewireless transducing circuit 70 shown in FIG. 14B is for illustrativepurposes only and the actual size of the wireless transducing circuit incomparison to the main body portion 1420 may vary, according to someembodiments. For example, the wireless transducing circuit 70 mayoverlap with the two-dimensional barcode 22. Other graphics, barcodes,information, or text may be printed or displayed on the tape node 1401,than what is shown in FIGS. 14A-14B.

The twisting portion does not include any electronic components orcomponents of the wireless transducing. According to some embodiments,the twisting portion includes a flexible wire 1415 between the flexiblesubstrate 110 and the cover layer 128 that provides structure for thetwisting portion. The flexible wire 1415 is configured to be bent andhold its shape after it has been bent. The flexible wire 1415 mayinclude a metal material, such as aluminum, tungsten, stainless steel,galvanized steel, copper, or some other material. In other embodiments,the flexible wire 1415 includes other types of materials that areconfigured to be bent.

In other embodiments, the twisting portion does not include the flexiblewire 1415, but includes a material that gives the twisting portion 1410structure. For example, a portion of the flexible substrate and/or thecover layer overlapping the twisting portion 1410 may include a plasticor paper material that allows the twisting portion 1410 to bend andretains its shape after bending.

FIGS. 15A-15B are exemplary diagrams showing an alternate embodiment ofthe tracking device configured to wrap around an object to be trackedwherein the tracking device includes an empty region, according to someembodiments. FIG. 15A is a top-down view of a non-adhesive side of atape node 1501. The tape node 1501 is an alternate embodiment of thetape node 1101 that includes an empty region on one half of the tapenode 1501. The empty region does not overlap with any electroniccomponents or battery components of the tape node 1501. Instead, all ofthe electronic components and battery components are disposed to overlapthe electronic component region 1520, on the other half of the tape node1501. The empty region overlaps a bending region of the tape node 1501where the tape node is configured to bend or wrap around an object thatis to be tracked. Other than the empty region 1540, the tape node 1501is substantially similar to the tape node 1101.

FIG. 15B shows the tape node 1501 being bent or wrapped around a portionof a cable 1102 for tracking the cable 1502. Since none of theelectronic components overlap the bending region 1530 that undergoesbending, the electronic components do not undergo physical stress orstrain during the bending of the tape node 1501 and are not damaged inthe process.

The above embodiments of tape nodes 1101, 1201, 1401, 1501, may each beconfigured to activate in response to being twisted or bent in a bendingregion. A tape node may initially be in a powered off or sleep state,before the tape node is bent and bending or twisting the tape node be apowering on or waking the tape node, similar to the response to cuttingor tearing of the tape node from the wake circuit described with respectto FIGS. 6A-6C. In some embodiments, twisting or bending may result in aportion of the electronic circuit rupturing or breaking, which isdetected by a wake circuit, like the wake circuit 275. The wake circuitactivates or powers on the wireless transducing circuit of the tapenode, in response. In some embodiments, the wake circuit detects whentwo conductive leads are forced into contact with each other due totwisting or bending of the tape node, which results in a change from anopen circuit state to a closed-circuit state in the wake circuit. Inresponse, the wake circuit activates or powers on the tape node.

In some embodiments, embodiments of a tape node 1101, 1201, 1301, 1401,1501 may be configured to detect when electrical current is flowingthrough a cable that the tape node is installed on. In some embodiments,the tape node includes a sensor that can detect electrical current or achange in electrical current flowing through the cable when the tapenode is attached or secured to the cable. For example, the tape node mayinclude a magnetic sensor, a sensor that detects inductance, aninductive loop, an electrical current sensor, a hall effect sensor, someother sensor for measuring magnetic fields, some other sensor formeasuring electrical inductance, some other sensor for measuringelectrical current or changes to electrical current, or some combinationthereof. In some embodiments, the connection part in the bending regionof a tape node (e.g., connection part 1140, 1250) forms an inductiveloop around the cable being monitored. One or more parts of theconnection part may be coupled to a sensor for measuring magnetic fieldsand may be used to detect the current or changes in current flowing inthe cable.

In further embodiments, a change in the power state of a piece ofequipment is monitored using a tape node installed on an electricalcable (e.g., a power cable) of the piece of equipment. The tape nodeinstalled on the electrical cable is configured to measure theelectrical current or change in electrical current in the electricalcable using a sensor of the tape node. The tape node and an identifierof the tape node is associated with the piece of equipment. For example,a database of the tracking system 400 may store the association. Basedon a detected change of electrical current, the tape node determinesthat the electrical equipment is powered on or is operating based ondetecting the sensed electrical current or change in electrical currentin the electrical cable. The tracking system may track the changes tothe power state of the piece of equipment based on data received fromthe tape node. The tracking system may then track the operational usageof the piece of equipment and take further actions based on the receiveddata.

Computer Apparatus

FIG. 16 shows an example embodiment of computer apparatus 320 that,either alone or in combination with one or more other computingapparatus, is operable to implement one or more of the computer systemsdescribed in this specification.

The computer apparatus 320 includes a processing unit 322, a systemmemory 324, and a system bus 326 that couples the processing unit 322 tothe various components of the computer apparatus 320. The processingunit 322 may include one or more data processors, each of which may bein the form of any one of various commercially available computerprocessors. The system memory 324 includes one or more computer-readablemedia that typically are associated with a software applicationaddressing space that defines the addresses that are available tosoftware applications. The system memory 324 may include a read onlymemory (ROM) that stores a basic input/output system (BIOS) thatcontains start-up routines for the computer apparatus 320, and a randomaccess memory (RAM). The system bus 326 may be a memory bus, aperipheral bus or a local bus, and may be compatible with any of avariety of bus protocols, including PCI, VESA, Microchannel, ISA, andEISA. The computer apparatus 320 also includes a persistent storagememory 328 (e.g., a hard drive, a floppy drive, a CD ROM drive, magnetictape drives, flash memory devices, and digital video disks) that isconnected to the system bus 326 and contains one or morecomputer-readable media disks that provide non-volatile or persistentstorage for data, data structures and computer-executable instructions.

A user may interact (e.g., input commands or data) with the computerapparatus 320 using one or more input devices 330 (e.g. one or morekeyboards, computer mice, microphones, cameras, joysticks, physicalmotion sensors, and touch pads). Information may be presented through agraphical user interface (GUI) that is presented to the user on adisplay monitor 332, which is controlled by a display controller 334.The computer apparatus 320 also may include other input/output hardware(e.g., peripheral output devices, such as speakers and a printer). Thecomputer apparatus 320 connects to other network nodes through a networkadapter 336 (also referred to as a “network interface card” or NIC).

A number of program modules may be stored in the system memory 324,including application programming interfaces 338 (APIs), an operatingsystem (OS) 340 (e.g., the Windows® operating system available fromMicrosoft Corporation of Redmond, Washington U.S.A.), softwareapplications 341 including one or more software applications programmingthe computer apparatus 320 to perform one or more of the steps, tasks,operations, or processes of the locationing and/or tracking systemsdescribed herein, drivers 342 (e.g., a GUI driver), network transportprotocols 344, and data 346 (e.g., input data, output data, programdata, a registry, and configuration settings).

Examples of the subject matter described herein, including the disclosedsystems, methods, processes, functional operations, and logic flows, canbe implemented in data processing apparatus (e.g., computer hardware anddigital electronic circuitry) operable to perform functions by operatingon input and generating output. Examples of the subject matter describedherein also can be tangibly embodied in software or firmware, as one ormore sets of computer instructions encoded on one or more tangiblenon-transitory carrier media (e.g., a machine readable storage device,substrate, or sequential access memory device) for execution by dataprocessing apparatus.

The details of specific implementations described herein may be specificto particular embodiments of particular inventions and should not beconstrued as limitations on the scope of any claimed invention. Forexample, features that are described in connection with separateembodiments may also be incorporated into a single embodiment, andfeatures that are described in connection with a single embodiment mayalso be implemented in multiple separate embodiments. In addition, thedisclosure of steps, tasks, operations, or processes being performed ina particular order does not necessarily require that those steps, tasks,operations, or processes be performed in the particular order; instead,in some cases, one or more of the disclosed steps, tasks, operations,and processes may be performed in a different order or in accordancewith a multi-tasking schedule or in parallel.

Other embodiments are within the scope of the claims.

Additional Configuration Information

The foregoing description of the embodiments of the disclosure have beenpresented for the purpose of illustration; it is not intended to beexhaustive or to limit the disclosure to the precise forms disclosed.Persons skilled in the relevant art can appreciate that manymodifications and variations are possible in light of the abovedisclosure.

Some portions of this description describe the embodiments of thedisclosure in terms of algorithms and symbolic representations ofoperations on information. These algorithmic descriptions andrepresentations are commonly used by those skilled in the dataprocessing arts to convey the substance of their work effectively toothers skilled in the art. These operations, while describedfunctionally, computationally, or logically, are understood to beimplemented by computer programs or equivalent electrical circuits,microcode, or the like. Furthermore, it has also proven convenient attimes, to refer to these arrangements of operations as modules, withoutloss of generality. The described operations and their associatedmodules may be embodied in software, firmware, hardware, or anycombinations thereof.

Any of the steps, operations, or processes described herein may beperformed or implemented with one or more hardware or software modules,alone or in combination with other devices. In one embodiment, asoftware module is implemented with a computer program productcomprising a computer-readable medium containing computer program code,which can be executed by a computer processor for performing any or allof the steps, operations, or processes described.

Embodiments of the disclosure may also relate to an apparatus forperforming the operations herein. This apparatus may be speciallyconstructed for the required purposes, and/or it may comprise ageneral-purpose computing device selectively activated or reconfiguredby a computer program stored in the computer. Such a computer programmay be stored in a non-transitory, tangible computer readable storagemedium, or any type of media suitable for storing electronicinstructions, which may be coupled to a computer system bus.Furthermore, any computing systems referred to in the specification mayinclude a single processor or may be architectures employing multipleprocessor designs for increased computing capability.

Embodiments of the disclosure may also relate to a product that isproduced by a computing process described herein. Such a product maycomprise information resulting from a computing process, where theinformation is stored on a non-transitory, tangible computer readablestorage medium and may include any embodiment of a computer programproduct or other data combination described herein.

Finally, the language used in the specification has been principallyselected for readability and instructional purposes, and it may not havebeen selected to delineate or circumscribe the inventive subject matter.It is therefore intended that the scope of the disclosure be limited notby this detailed description, but rather by any claims that issue on anapplication based hereon. Accordingly, the disclosure of the embodimentsis intended to be illustrative, but not limiting, of the scope of thedisclosure, which is set forth in the following claims.

What is claimed is:
 1. A flexible tracking device for monitoring a cablecomprising: A flexible substrate; a battery; a device layer comprising:a processor, a memory coupled to the processor a first wirelesscommunication antenna connected to a first wireless communicationinterface; a flexible circuit connecting components of the device layerand the battery; a flexible cover layer on the substrate covering theflexible substrate, the battery, the device layer, and the flexiblecircuit; a bending region configured to undergo a bend, wherein thebending region does not overlap with components of the device layer thathave a low tolerance for bending.
 2. The flexible tracking device ofclaim 1, further comprising: an electronic component region positionedadjacent to a first side of the bending region; and an energy storageregion positioned adjacent to a second side of the bending regionopposite the first side; wherein components of the device layer arepositioned to overlap with the electronic component region and notoverlap with the bending region, and the battery is positioned tooverlap with the energy storage region but not with the bending region.3. The flexible tracking device of claim 2, further comprising aconnection part in the bending region that extends from the energystorage region to the electronic component region, the connection partconfigured to electrically connect the battery to a portion of theflexible circuit in the electronic component region.
 4. The flexibletracking device of claim 1, wherein a first width of the flexibletracking device in the bending region is smaller than a second width ofthe tracking device in other regions of the tracking device.
 5. Theflexible tracking device of claim 1, wherein the flexible trackingdevice includes a guideline displayed on an exterior surface of theflexible tracking device, the guideline overlapping the bending regionand indicating a line along which the flexible tracking device isoperable to be bent.
 6. The flexible tracking device of claim 1, whereinthe flexible tracking device is configured to bend around a cable at thebending region.
 7. The flexible tracking device of claim 6, wherein theflexible tracking device is further configured to track a location ofthe cable.
 8. The flexible tracking device of claim 6, wherein the cableis an electrical cable, and the device layer of the flexible trackingdevice further comprises a sensor configured to detect a change in amagnetic field near the electrical cable when the flexible trackingdevice is bent around the cable at the bending region.
 9. The flexibletracking device of claim 8, wherein the flexible tracking device isconfigured to determine a flow of electrical current or a change in theflow of electrical current through the electrical cable based on sensingthe magnetic field or a change to the magnetic field near the electricalcable.
 10. The flexible tracking device of claim 9, wherein the flexibletracking device is configured to determine a power state of a piece ofequipment that the electrical cable is coupled to based on thedetermined flow of electrical current through the cable.
 11. Theflexible tracking device of claim 8, wherein the sensor comprises a halleffect sensor.
 12. The flexible tracking device of claim 1, wherein thebending region corresponds to a center of the flexible tracking device,and the device layer and the battery are positioned in a first half ofthe flexible tracking device such that the device layer and the batterydo not overlap the bending region and a second half of the flexibletracking device opposite the first half.
 13. The flexible trackingdevice of claim 1, further comprising an adhesive on an exterior surfaceof the flexible substrate, wherein the flexible tracking device isconfigured to adhere to an object or adhere to a portion of itself. 14.A method for tracking a cable comprising: securing a tape node to thecable; associating an identifier of the tape node with the cable in adatabase of a tracking system; wirelessly communicating with the tapenode using a device node or gateway node of the tracking system;determining a location of the tape node based on wireless communicationsbetween the device node or the gateway node of the tracking system andthe tape node; and responsive to determining the location of the tapenode, updating a database of the tracking system with a location of thecable which corresponds to the determined location of the tape node. 15.The method of claim 13, wherein the securing the tape node to the cablecomprises bending the tape node around the cable at a bending portion ofthe tape node.
 16. The method of claim 15, wherein the tape nodecomprises an adhesive on an exterior surface of the tape node, and thesecuring the tape node to the cable further comprises adhering the tapenode to the cable and adhering portions of the tape node to anotherportion of the tape node.
 17. A system for tracking cables comprising: aplurality of tape nodes, each tape node attached to a respective cableand comprising: a first type of wireless communication system, and anidentifier associated with the respective cable; one or more gatewaynodes, each gateway node associated with a fixed location and comprisingthe first type of wireless communication system and a second type ofwireless communication system, wherein each gateway node is configuredto communicate with one or more of the plurality of tape nodes using thefirst type of wireless communication system and communicate with aserver using the second type of wireless communication system; theserver; and a database storing the association of each identifier of theplurality of tape nodes with a respective cable, the fixed location ofeach of the one or more gateway nodes, and a history of location datafor each of the plurality of tape nodes, wherein the server determines alocation of each of the plurality of tape nodes based on each tape nodewirelessly communicating with one of the one or more gateway nodes, thelocation of each of the plurality of tape nodes corresponding to alocation of the respective cable.
 18. The system for tracking cables ofclaim 17, further comprising a client device configured to wirelesslycommunicate with one or more of the plurality of tape nodes using thefirst type of wireless communication system and determine a location ofthe one or more tape nodes based on the wireless communication and on aknown location of the client device.
 19. The system for tracking cablesof claim 18, wherein the client device is a smartphone.
 20. The systemfor tracking cables of claim 17, wherein the first type of wirelesscommunication system is one of a Bluetooth communication system,Bluetooth low energy (BLE) communication system, Zigbee communicationsystem, and ultra-wideband communication system.